Other

Magic Leap, Inc.

Cooler Master Co., Ltd.

Cooler Master Corp.

Ralph Remsburg

Evan Francis Rynk

Guillermo Padin Rohena

Adrian Kaehler

Shigeru G Natsume

Haney Awad

William Wheeler

Bradley Fraser

Carlos Julio Suate Pedroza

Gary Quartana, Jr

John Aguirre

Youlin Jin

Gary Quartana Jr

Apparatus and methods for displaying an image by a rotating structure are provided. The rotating structure can comprise blades of a fan. The fan can be a cooling fan for an electronics device such as an augmented reality display. In some embodiments, the rotating structure comprises light sources that emit light to generate the image. The light sources can comprise light-field emitters. In other embodiments, the rotating structure is illuminated by an external (e.g., non-rotating) light source.

Fan assembly for displaying an image

A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.

Power supply assembly with fan assembly for electronic device

Apparatus and methods for displaying an image by a rotating structure are provided. The rotating structure can comprise blades of a fan. The fan can be a cooling fan for an electronics device such as an augmented reality display. In some embodiments, the rotating structure comprises light sources that emit light to generate the image. The light sources can comprises light-field emitters. In other embodiments, the rotating structure is illuminated by an external (e.g., non-rotating) light source.

A method for producing a bonded functionally graded Material (FGM) structure, includes the steps of providing a plurality of dissimilar material layers; forming a first group and a second group of through holes alternately on a plurality of intermediate dissimilar material layers and on a bottom dissimilar material layer, wherein the first group of through holes has a diameter larger than a diameter of the second group of through holes; stacking the plurality of dissimilar material layers on top of one another. A first group of through holes on any dissimilar material layer is arranged corresponding to a second group of through holes on a dissimilar material layer stacked above, and a second group of through holes on any dissimilar material layer is arranged corresponding to a first group of through holes on a dissimilar material stacked right below; and bonding the plurality of dissimilar material layers.

Bonded functionally graded material structure for heat transfer and CTE matching and method of making same

A bonded dissimilar material structure includes a first component made of a first dissimilar material; a second component made of a second dissimilar material stacked under the first component; and a plurality of blind holes formed on an upper surface of the second component; and the first component has a plurality of protrusions formed in the plurality of blind holes on the second component, respectively.

Bonded aluminum-dissimilar metal structure and method of making same

A bonded functionally graded Material (FGM) structure, includes a plurality of dissimilar material layers, a first group and a second group of through holes alternately on a plurality of intermediate dissimilar material layers and on a bottom dissimilar material layer. The first group of through holes have a diameter larger than a diameter of the second group of through holes. The plurality of dissimilar material layers are stacked on top of one another. A first group of through holes on any dissimilar material layer is arranged corresponding to a second group of through holes on a dissimilar material layer stacked above, and a second group of through holes on any dissimilar material layer is arranged corresponding to a first group of through holes on a dissimilar material stacked right below. The plurality of dissimilar material layers are also bonded.

Bonded functionally graded material structure for heat transfer

A bonded dissimilar material heat transfer assembly is provided. The assembly comprises a frame component, a thin stamped component and at least one dissimilar metal component having means for heat transfer and having a higher thermal conductivity than the frame component and stamped component. The heat transfer assembly includes a novel geometry such that distortion caused by mismatch of thermal expansion rates does not affect the normally planar shape of the assembly. Such a construction leads to higher thermal performance, lighter weight, less cost, and higher reliability than similar prior art heat exchanger assemblies.

Heat sink having thermal distortion compensation

Apparatus for automatic environmental control includes an enclosed, zoned structure. A heating, ventilation and air conditioning (HVAC) system is incorporated into the structure. Each zone includes separate controls, separately-controlled air flow into and out of each zone, and separate intake, vent, damper, thermostat and humidistat for each zone. Temperature and humidity are separately controllable for each zone, and controller is in communication with HVAC system for controlling HVAC system and for controlling the damper for each zone, the controller having a map comprising a plurality of relative humidity and temperature combinations and one or more actions for automatic execution based on the combinations of temperature and humidity. A temperature sensor, a relative humidity sensor are included in each zone, and an indicator array/interface panel is in communication with the controller. The system provides for the automatic elimination of environmental conditions favorable to mold and fungus growth for each zone individually.

Automatic mold and fungus growth inhibition system and method

An apparatus for monitoring environmental conditions favorable for mold, mildew and fungus growth includes a microprocessor having a data map, a temperature sensor attached to the microprocessor, a relative humidity sensor attached to the microprocessor, an indicator array attached to the microprocessor, and a power supply attached to the microprocessor. The indicator array may be a single warning light or an array with a plurality of warning lights. The indicator array may also be an audio speaker. The indicator array may also include a message display for digitally displaying one or more ambient condition.

Mold and fungus growth warning apparatus and method

An apparatus for monitoring environmental conditions favorable for mold, mildew and fungus growth includes a microprocessor having a data map, a temperature sensor attached to the microprocessor, a relative humidity sensor attached to the microprocessor, an indicator array attached to the microprocessor, and a power supply attached to the microprocessor. The map has a plurality of relative humidity and temperature combinations and one or more suggested actions, for the user, based on the combinations. The indicator array may be a single warning light or an array with a plurality of warning lights. The indicator array may also be a text display or an audio speaker for displaying one or more ambient conditions or suggested actions. Barometric pressure data may also be included with the map for more comprehensive suggestions for action.

A structure or enclosure with a solar energy absorbing system, arranged so that at least one wall faces the sun and at least one wall is shaded. The structure has a thermal switch between the solar energy absorbing unit and a solar energy storage unit. The structure has a thermal switch between the solar energy storage unit and the interior. The structure has a thermal switch between the shaded wall of the structure and a heat dissipating heat sink. The thermal switch between the solar energy absorbing unit and the solar energy storage unit is modular and is replaceable with other thermal switches having different temperature set points. The thermal switches control the temperature of the interior of the structure in varying climates and sunlight conditions to within a desirable and limited range.

Growing community of inventors

Midland, TX, United States of America

Ralph Remsburg