International Business Machines Corporation

Ralph R Comulada

John Peter Karidis

Michael F Lofaro

Francis R Krug, Jr

Mukta S Farooq

Paul F Bodenweber

Yuet-Ying Yu

Christopher Lee Tessler

Fen Fen Jamin

Kenneth M Davis

Joseph P Pawletko

Charles J Hendricks

Bradley Paul Jones

Bouwe W Leenstra

Vincent P Peterson

Kathleen M Wiley

Terence W Spoor

Philo B Hodge

Gerard Mc Vicker

Disclosed is an interposer and test structure for making contact between a substrate and a test bed. One embodiment of the interposer has a floating, rigid conductive element in a nonconductive body which makes temporary contact between the test bed and the substrate. In another embodiment of the invention, the interposer includes two layers of material, in which one layer includes pogo pins for contacting the substrate and the other layer includes pads for contacting the test bed. The pogo pins are on a grid spacing corresponding to that of the substrate input/output pads while the interposer pads are on a grid spacing corresponding to that of the pogo pin contactors of the test bed.

Interposer for maintaining temporary contact between a substrate and a test bed

A system for chemical-mechanical polishing is described which includes a wafer backing film having concentric first and second portions, and a wafer carrier having corresponding first and second portions for mounting the portions of the wafer backing film thereon. The portions of the wafer backing film are of different materials. The second portion of the wafer backing film has an annular shape and surrounds the first portion; the second portion of the wafer carrier is adjustable with respect to the first portion of the wafer carrier in a vertical direction. The second portion of the wafer backing film is less compressible than the first portion, and is adjusted in the vertical direction so that the outer edge of the wafer is substantially sealed when backside air is applied to the wafer during a film removal process.

Chemical-mechanical polishing system having a bi-material wafer backing film and two-piece wafer carrier

A reference chuck which is used with a leveling device for holding microelectronic substrates and other electronic component substrates for laser ablation and other exposure processes, the chuck comprising a frame body for supporting the substrate to be processed, clamping means at the periphery of the frame body for holding the substrate to the frame body and elastomeric means for urging the substrate mounted in the reference chuck against the clamping means. The undersides of the clamping means which contacts the upper surface of the substrate forms in its tightened position a clamping plane which clamping plane is parallel with an established plane of the lower surface of the chuck. The reference chuck provides a very low profile envelope for use with conventional leveling devices and the top surface of the substrate and the lower surface of the reference chuck are in parallel planes when the chuck is placed on the working surface of the leveling device.

Laser ablation top surface reference chuck

An actuator for use in positioning a probe. The actuator has a magnet, two C-shaped cores on opposite sides of the magnet, an electromagnetic coil, and an armature movably connected with the cores. The armature has a projecting face located over portions of both pole faces for each core for the entire range of motion of the armature. The armature is primarily retained with the cores by magnetic attraction by the magnet. The actuator also has an armature position sensor which can include either an optical sensor or a magnetic sensor. A test probe is mounted to the armature which can be preloaded and have dual springs to prevent scrubbing and increase contact force with an object being tested.

Probe positioning actuator

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Rock Tavern, NY, United States of America

Ralph R Comulada