Osram Opto Semiconductors Gmbh

Diehl Aerospace Gmbh

Diehl Aircabin Gmbh

Asca Gmbh

Siemens Aktiengesellschaft

Osram Oled Gmbh

Asca Gmbh & Co. Kg

Ralph Pätzold

Günter Schmid

Karsten Heuser

Andreas Kanitz

Marc Philippens

Georg Wittmann

Tilman Schlenker

Jan Birnstock

Ralf D Krause

Debora Henseler

Arvid Hunze

Heribert Zull

Wiebke Sarfert

Frank Schmid

David Hartmann

Christian Schmid

Dirk-Achim Schevardo

Marc Renz

Christoph Gaerditz

Oliver Weiss

Riikka Suhonen

Markus Klingseis

Norbert Knopp

Wolf-Dieter Kuhnla

Dietmar Völkle

Peter Younes

Jürgen Grabmann

Christoph Gärditz

Wiebke Sarfert-Gast

Günter Gieres

Pavel Schilinsky

Bas Cedric Van Der Wiel

Markus Klein

Arici Elif Bogner

Chistoph Gärditz

Alexander Mäder

A semiconductor module has a layer structure and at least one capacitive sensor. The layer structure is formed with an upper electrode layer, a lower electrode layer, and an active layer arranged between the electrode layers. The active layer is made of a semiconductor material. The capacitive sensor has a measuring electrode which is integrated into the layer structure. There is also described a device which has such a semiconductor module and a method for producing such a semiconductor module.

Semiconductor module and method for producing same

A solution-processed organic electronic structural element has an improved electrode layer. Located between the active organic layer and the electrode layer there is either an interface or an interlayer containing a cesium salt.

Solution-processed organic electronic structural element with improved electrode layer

The description covers cabin components for aircraft, which can be produced with a sandwich structure and may have the componentsfor signal and/or power transmission. The cabin components in this case have at least two prepreg layersand, for example, a honeycomb layer, which can be connected to one another by pressing and heating. Furthermore, electrical and/or optical signal paths are shown on cabin components, which can be produced by positioning them there or printing. In addition, according to the description, signal and/or power transmission can take place beyond the boundary of cabin components, by means of a transmitter/receiver path.

Elements for signal and/or power transmission into or to cabin components

A planar electronic component has a functional layer with an optoelectronic or a circuit configuration between a substrate layer and a covering layer. A sealing frame or sealing ring is disposed between the substrate layer and the covering layer and connected to them by an integral joint surrounding the functional layer. The seal very largely protects the functional layer against hazardous external influences, in particular against moisture and oxygen. A mechanical connector, whose adhesive characteristics are matched to the materials of the covering layer and of the substrate, is provided in addition to the sealing ring. The connector fixes the substrate and covering layers mechanically with respect to one another, and may reduce the risk of partial or complete detachment in the event of deformation of the electronic component, in particular as a result of thermal expansion and/or mechanical loading.

Component with mechanical connector, in particular a display apparatus with organic light-emitting diodes

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Roth, Germany

Ralph Pätzold