Lucent Technologies Inc.

Avaya Technologies Corp

Plessey Electronic Systems Corp.

Ralph Liguori

Harry C Beals, Jr

Claude W Duvall

Ronald B Walsh

Quang Duong

Lothar Laermer

Kurt R Goldhammer

Philip C Sinclair

Barbara M Gunther

Damon C Owens

Dana L Ross

Cabinet mounting structure where the rear of the cabinet is inaccessible. The structure includes anchors mounted to the rear of the cabinet. A base plate having receptacles secured thereon is installed on a supporting surface. The receptacles are formed with cavities into which the anchors are inserted, thereby holding down the rear of the cabinet. The front of the cabinet is secured to the supporting surface by mounting bolts extending through the cabinet floor.

Cabinet mounting structure

A tool for verifying the wetting of a &ldquo;Hollow D&rdquo; gasket adhesive sealing a panel, door or cabinet frame substrate and the like, including a pair of substantially symmetrical gripping surfaces having upper portions fastened together to receive a force gauge for measuring the upwards pulling on the gasket, and also having lower portions with inwardly facing extensions of a thickness equal to or less than that of the adhesive carrier for grasping the gasket when in place, and with a spacing between the facing extensions equal to or greater than the width of the adhesive carrier of the gasket.

Gasket adhesion test grip tool

A hand tool for compressing a 'Hollow D' gasket against an edge surface of a panel, door or cabinet frame including a handle, and also including a stepped-roller having a raised section for applying direct pressure substantially only at the central area of the gasket overlying the adhesive strip on its back surface, and not to its side areas, for allowing thorough wetting of the adhesive along the edge surface to be secured.

Hollow D' gasket roller

A Very Large Hybrid Module (VLHM) for packaging electronic components provides a hermetic enclosure formed by a hermetic substrate on which the components are mounted together with a hermetic lid surrounding groups of the components. A second substrate outside the hermetic enclosure is utilized for providing connections between the electronic components.

Hybrid module electronics package

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Oakland, NJ, United States of America

Ralph Liguori