International Business Machines Corporation

Ralph E Parsons

Voya Rista Markovich

Carlos Juan Sambucetti

Roy H Magnuson

William J Amelio

William H Lawrence

Gary K Lemon

Robert W Johnson

Peter G Bartolotta

A non-conductive substrate is conditioned for subsequent selective deposition of a metal thereon by providing at least one of the major surfaces of the substrate in roughened form, contacting that surface(s) with a palladium/tin catalyst, activating the catalyst by employing an alkali hydroxide solution, laminating a photosensitive composition to the major surface(s), and exposing the photosensitive composition to actinic light in a predetermined pattern and then developing to provide the predetermined pattern.

Conditioning a non-conductive substrate for subsequent selective

An electroless copper plating bath having improved stability which contains a cationic polymer from acrylamide and/or methacrylamide. The plating bath also contains a cupric ion source, a reducing agent for the cupric ion source, and a complexing agent for the cupric ion.

Electroless copper plating bath and improved stability

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Endicott, NY, United States of America

Ralph E Parsons