Growing community of inventors

Berlin, Germany

Ralf Schmidt

Average Co-Inventor Count = 5.46

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 2

Ralf SchmidtJosef Gaida (3 patents)Ralf SchmidtJens Palm (3 patents)Ralf SchmidtHimendra Jha (3 patents)Ralf SchmidtDirk Rohde (2 patents)Ralf SchmidtOlivier Mann (2 patents)Ralf SchmidtAngela Llavona-Serrano (2 patents)Ralf SchmidtFrank Von Horsten (2 patents)Ralf SchmidtKun Si (2 patents)Ralf SchmidtOnas Bolton (2 patents)Ralf SchmidtAndreas Ostmann (1 patent)Ralf SchmidtLothar Dietrich (1 patent)Ralf SchmidtGrigory Vazhenin (3 patents)Ralf SchmidtChristian Schwarz (1 patent)Ralf SchmidtWilli Rohland (1 patent)Ralf SchmidtRecep Kocer (0 patent)Ralf SchmidtFrank Von-Horsten (0 patent)Ralf SchmidtRalf Schmidt (4 patents)Josef GaidaJosef Gaida (11 patents)Jens PalmJens Palm (4 patents)Himendra JhaHimendra Jha (3 patents)Dirk RohdeDirk Rohde (10 patents)Olivier MannOlivier Mann (7 patents)Angela Llavona-SerranoAngela Llavona-Serrano (4 patents)Frank Von HorstenFrank Von Horsten (2 patents)Kun SiKun Si (2 patents)Onas BoltonOnas Bolton (2 patents)Andreas OstmannAndreas Ostmann (13 patents)Lothar DietrichLothar Dietrich (6 patents)Grigory VazheninGrigory Vazhenin (3 patents)Christian SchwarzChristian Schwarz (1 patent)Willi RohlandWilli Rohland (1 patent)Recep KocerRecep Kocer (0 patent)Frank Von-HorstenFrank Von-Horsten (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Atotech Deutschland Gmbh (2 from 288 patents)

2. Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. (1 from 4,804 patents)

3. Atotech Deutschland Gmbh & Co. Kg (1 from 13 patents)


4 patents:

1. 12071702 - Acidic aqueous composition for electrolytic copper plating

2. 12054843 - Acidic aqueous composition for electrolytically depositing a copper deposit

3. 11035051 - Acidic aqueous composition for electrolytic copper plating

4. 9243341 - Device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment

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as of
12/5/2025
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