International Business Machines Corporation

Ralf Richter

Lukas Daellenbach

Elmar Gaugler

Thomas Hess

Markus K Strasser

Martin Raitza

Philip Sebastian Schulz

Cedric Lichtenau

Michael Klein

Wilhelm Ernst Haller

Stefan Payer

A computer implemented method for a multi-layer integrated circuit routing tool connecting sources with nets to sinks in a hierarchical multi-layer integrated circuit design environment, the method including creating a cycle reach table containing a first set of information parameters for two dimensional nets per metal layer combination, creating a repeater reach table containing a second set of information parameters per constraint class, preparing a working list of nets, preparing a list of blocks larger than repeater reach dimensions, connecting a source pin to a sink pin on preassigned metal layers, by routing the net based on the given constraint class.

Multi-layer integrated circuit routing tool

A semiconductor circuit design method, system and computer program product for placing a unit pin on a boundary of a unit of a semiconductor circuit to be designed may be provided. Pin position data is received, wherein the pin position data comprises a chip pin position of a chip pin within the chip area and outside of the unit of a semiconductor circuit, to which the unit pin is to be electrically connected. The coordinates of a center point of the unit are determined, as well as a line crossing the center point and the chip pin position. The unit pin is placed on an intersection of the boundary of the unit and the line crossing the center point.

Semiconductor circuit design and unit pin placement

A system, apparatus, and method of testing a plurality of test circuits is disclosed that includes inputting experiment data to the plurality of test circuits; applying a control signal to each of the plurality of test circuits to control application of the experiment data to the plurality of test circuits; and shifting the control signal in response to applying the control signal to each of the plurality of test circuits so that a different bit of the control signal is applied to each of the plurality of test circuits. The method in an aspect further comprises reading out a data out signal from each of the plurality of test circuits; and shifting the data out signal in response to reading out the data out signal from each of the plurality of test circuits.

Method and apparatus for wiring multiple technology evaluation circuits

A method is provided for operating a trace procedure, which traces execution of a computer program, where the program uses different callable modules. A program stack is used to store trace buffer information and an error state, and the modules include calls of the trace procedure. The method includes: (i) when entering execution of a module, storing the current write position of the trace buffer and a cleared error flag in the current frame of the stack; (ii) in case of an error condition during execution of the program, setting the error flag in the current frame; and (iii) when leaving execution of a module, determining if the error flag is set, and if not, then rewinding the trace buffer to the write position stored in the current frame, and deleting the current write position of the trace buffer and the error flag from the stack.

Operating a trace procedure for a computer program

Optimized buffer placement is provided based on timing and capacitance assertions in a functional chip unit including a single source and multiple macros, each having a sink. Placement of the source and macros with the sinks is pre-designed and buffers are placed in branches connecting the source with the multiple sinks. An estimated slack is calculated for each branch, the branches are arranged according to the calculated slack, decoupling buffers are inserted in all branches except the most critical branch(es), the most critical branch(es) are globally routed and slew conditions are fixed within this branch, and at least one next branch is globally routed and slew conditions are fixed therein.

Optimized buffer placement based on timing and capacitance assertions

A method is provided for optimized buffer placement based on timing and capacitance assertions in a functional chip unit including a single source and multiple macros, each having a sink. Placement of the source and macros with the sinks is pre-designed and buffers are placed in branches connecting the source with the multiple sinks. The method includes: calculating an estimated slack for each branch based on cycle reach, calculating a minimum slack for each branch, arranging branches according to the calculated slack to evaluate at least one most critical branch, inserting decoupling buffers in all branches except the most critical branch(es) and placing decoupling buffers close to the source, globally routing the most critical branch(es) and fixing slew conditions within this branch, globally routing at least one subsequent branch as arranged according to the calculated slack and fixing slew conditions within this branch(es), and routing all remaining branches.

A computerized method, data processing system and computer program product reduce noise for a buffered design of an electronic circuit which was already placed and routed. For all areas between a power stripe and a ground stripe (half bay) in the design, the shapes are divided in different criticality levels. The shapes are rearranged based on their criticality level such that shapes with higher criticality level are placed closer to the stripes than those with lower criticality level.

Growing community of inventors

Unterhausen, Germany

Ralf Richter