Ebm-papst St. Georgen Gmbh & Co Kg

Ralf-Michael Sander

Hermann Rappenecker

Alexander Hahn

Harald Schmid

Volker Ehlers

Wilhelm Weisser

A printed circuit board module () has a printed circuit board () with a first side (), a second side () and a contact hole (). A sleeve-type via () is provided in the contact hole. An annular ring () is associated with the via (), on at least one side (). The annular ring () is arranged on the first side () or on the second side () of the printed circuit board (). The annular ring () is electrically connected to the via (). The annular ring () has an annular ring edge (), at least in sections. The printed circuit board module () has a solder resist layer (). It extends, at least in sections, from outside the annular ring edge () over the annular ring edge () to an outer region () of the annular ring (). An inner region () not covered with the solder resist layer (), remains on the annular ring ().

Printed circuit board module

A circuit board () is equipped with at least one conductor path () and a contact element (). The latter is adapted to mechanically engage and electrically contact an electrical conductor (). In the region of a conductor path (), the circuit board () has passthrough orifices (). The contact element () has a base part () and feet () which press-fit into the orifices (to) of the circuit board (). The contact element () has a contact tongue () that is resiliently articulated on the base part () and clamps the electrical conductor (). This makes possible a secure connection from the electrical conductor () to the circuit board (), e.g. for connecting a device having a large current demand.

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St. Georgen, Germany

Ralf-Michael Sander