Texas Instruments Corporation

Ralf Jakobskrueger Muenster

Benjamin Stassen Cook

Sreenivasan Kalyani Koduri

Scott Robert Summerfelt

Juan Alejandro Herbsommer

Ali Djabbari

In some examples, a system comprises a set of nanoparticles and a set of nanowires extending from the set of nanoparticles.

Nanowires plated on nanoparticles

In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.

Dielectric and metallic nanowire bond layers

In some examples, a semiconductor package comprises a semiconductor die having a first surface and a second surface opposing the first surface. The package comprises an orifice extending through a thickness of the semiconductor die from the first surface to the second surface. The package comprises a set of metallic nanowires positioned within the orifice and extending through the thickness of the semiconductor die from the first surface to the second surface.

Semiconductor die orifices containing metallic nanowires

A system comprises a member to receive a mechanical force, and a sensor to sense the mechanical force. The sensor is mounted on the member using a set of nanoparticles and a set of nanowires coupled to the set of nanoparticles.

Nanomaterials for attaching mechanical force sensors

In some examples, a system comprises a first component having a first surface, a first set of nanoparticles coupled to the first surface, and a first set of nanowires extending from the first set of nanoparticles. The system also comprises a second component having a second surface, a second set of nanoparticles coupled to the second surface, and a second set of nanowires extending from the second set of nanoparticles. The system further includes an adhesive positioned between the first and second surfaces. The first and second sets of nanowires are positioned within the adhesive.

Nanowire interfaces

An apparatus includes a housing for an electronic circuit. The housing includes at least three planes that form a structure to house the electronic circuit. At least one channel is formed along at least one of the three planes to provide a waveguide in the housing for wireless communications. A wireless communications module communicates via the waveguide to control the electronic circuit enclosed in the housing.

Growing community of inventors

Saratoga, CA, United States of America

Ralf Jakobskrueger Muenster