Robert Boschgmbh

Ralf Haug

Werner Gruenwald

Kurt Schmid

Manfred Moser

Annette Seibold

Thomas Burkhart

Helmut Schmidt

Martin Mennig

Frank-Dieter Hauschild

Martin Seyffert

Karl-Hermann Friese

Harald Neumann

Claudio De La Prieta

Gerhard Schneider

Walter Roethlingshoefer

Hans-Joerg Renz

Uwe Glanz

Ulrich Goebel

Lothar Weber

Reiner Schuetz

Kurt Bayha

Carmen Schmiedel

Erwin Liegl

Dorothee Kling

Herbert Gentner

Monika Schneider

Holger Guenster

Stefan Kuschel

An electrical device includes two housing parts that may be joined to form one closed housing, the housing parts in the joined state enclosing a housing interior space, as well as an electrical/electronic circuit element arranged in the housing inner space, and a sealing material for protecting the circuit element. The two housing parts may be configured as half-shells and the interior area of the half-shells, in each case, may be subdivided by interior walls into at least two chambers, of which, in each case, a first chamber is filled with the sealing material and has spatial dimensions which are greater than the dimensions of the circuit element, the interior walls of the second half-shell, in the joined state of the two half-shells, overlapping the interior walls of the first half-shell with clearance, the interior walls of the first half-shell penetrating somewhat into the first chamber of the second half-shell, and the circuit element between the two half-shells being enveloped by the sealing material contained in the two first chambers, up to its electrical connections.

Encapsulated electrical device

Process for the currentless metallization of electrically non-conductive

Process for producing an electrically conductive connection

Anisotropically conducting adhesive

Anisotropically conducting adhesive, and process for producing an

Electrochemical measuring sensor and method for producing an

Method for joining an electrical connection of a non-packaged IC

In a method for producing a multilayer circuit, it is possible to produce capacitor structures including electrodes and a dielectric arranged in between. By pressing the capacitor structures into a ceramic layer, it is possible to produce a high-quality capacitor inside the multilayer circuit.

Method for producing a multilayer circuit

Growing community of inventors

Leonberg, Germany

Ralf Haug