Koninklijke Philips Corporation N.v.

Ushio Denki Kabushiki Kaisha

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Philips Photonics Gmbh

Ralf Gordon Conrads

Stephan Gronenborn

Gero Heusler

Holger Joachim Moench

Dominik Marcel Vaudrevange

Gota Niimi

Maghiel Jan Kole

Carsten Deppe

Jeroen Jonkers

Guenther Hans Derra

Pavel Pekarski

Klaus Bergmann

Hendrik Huisman

Ralf Pruemmer

Wilhelmus V J Van Nunspeet

Johanna Sophie Kolb

Holger Möench

Felix Kuepper

Johannes W J L Cuijpers

Andre Matthias Prinz

Xi Gu

Ralf PRÜMMER

Felix KÜPPER

The invention describes a laser printing system () for illuminating an object moving relative to a laser module of the laser printing system () in a working plane () and a corresponding method of laser printing. The laser module comprises at least two laser arrays () of semiconductor lasers () and at least one optical element (). The optical element () is adapted to image laser light emitted by the laser arrays (), such that laser light of semiconductor lasers () of one laser array () is imaged to one pixel in a working plane () of the laser printing system () and an area element of the pixel is illuminated by means of at least two semiconductor lasers (). The optical element does not project or focus laser light of each single semiconductor laser () to the working plane () but images the whole laser arrays to the working plane. The overlap of the laser light emitted by the semiconductor lasers () may improve the homogeneity of illumination or energy input and the reliability regarding malfunctions of single semiconductor lasers ().

Laser printing system

The invention describes a heating system () and a corresponding method of heating a heating surface () of an object () to a processing temperature of at least 100&#xb0; C., wherein the heating system () comprises semiconductor light sources (), and wherein the heating system () is adapted to heat an area element of the heating surface () with at least 50 semiconductor light sources () at the same time. The heating system () may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources () overlaps at the heating surface (). Differences of the characteristic of one single semiconductor light source () may be blurred at the heating surface () such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.

Heating system comprising semiconductor light sources

The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers () for transmitting electrical current and at least one electrically insulating layer () comprising electrically insulating material, wherein the electrically conductive layers () and the electrically insulating layer () are arranged in an alternating assembly such that the two electrically conductive layers () are electrically insulated with respect to each other by means of the electrically insulating layer (), wherein each of the electrically conductive layers () is adapted to be coupled to a bond wire () independently from the other electrically conductive layer () at a side surface of the printed circuit board being inclined to the top side and the bottom side of the printed circuit board. The invention further describes a corresponding method of fabricating the printed circuit board. The invention further describes a printed circuit board arrangement comprising the printed circuit board and a corresponding method of fabricating the printed circuit board arrangement.

Printed circuit board and printed circuit board arrangement

The invention describes carrier structure () for assembling a semiconductor lighting module, comprising at least two sub carriers () and an alignment structure () mechanically coupling the sub carriers (). The alignment structure () is adapted such that the mechanical coupling to at least a part of the sub carriers () disappears during thermal mating the carrier structure () on a carrier (). The alignment structure () is further adapted to compensate a coefficient of thermal expansion of a material of the carrier () being higher than a coefficient of thermal expansion of a material of the carrier structure (). The invention further describes a semiconductor chip comprising such a carrier structure () and a semiconductor lighting module comprising the carrier structure () or the semiconductor chip. The invention finally describes a corresponding method of manufacturing a semiconductor lighting module. The invention enables assembling of semiconductor lighting modules by thermal mating with reduced alignment effort.

Laser module with simplified alignment

An arrangement for cooling a plasma-based radiation source with a metal cooling liquid and a method for starting up a cooling arrangement of this type has a pump unit for conveying the metal cooling liquid from a reservoir to an immersion bath in a pipe portion that is connected to the reservoir in the conveying direction of the cooling circuit has at least one pump for conveying the metal cooling liquid through an external field effect of the at least one pump. A control unit for controlling the at least one pump controls the at least one pump at least temporarily in a pumping direction opposite to the conveying direction of the cooling circuit in order to generate a heating effect through external field effect on metal cooling liquid located in the pipe portion.

Arrangement for cooling a plasma-based radiation source with a metal cooling liquid and method for starting up a cooling arrangement of this type

The present invention relates to a method and device for generating optical radiation (), in particular EUV radiation or soft x-rays, by means of electrically operated discharges. A plasma () is ignited in a gaseous medium between at least two electrodes (), wherein said gaseous medium is produced at least partly from a liquid material (), which is applied to one or several surface(s) moving in the discharge space and is at least partially evaporated by one or several pulsed energy beam(s) (). At least two consecutive pulses () are applied within a time interval of each electrical discharge onto said surface(s). The delay between and/or the pulse energy of said consecutive pulses is controlled to stabilize the position of an emission center of the plasma ().

Method and device for generating optical radiation by means of electrically operated pulsed discharges

An arrangements and methods for cooling a plasma-based radiation source having a revolving element which is to be cooled, particularly for application in EUV radiation sources, is disclosed. The revolving element is immersed in the metal coolant in a first vessel of a primary cooling circuit, and a secondary cooling circuit with a cooling liquid evaporating at the desired operating temperature of the metal coolant has a control unit for controlling at least one atomizing arrangement in a differentiated manner and for selectively controlling a heater in case the determined temperature falls below a minimum operating temperature of the metal coolant. The at least one atomizing arrangement in a cooling section selectively sprays individual wall regions of the first vessel with the cooling liquid depending on the determined temperature of the metal coolant.

Arrangement and method for cooling a plasma-based radiation source

Growing community of inventors

Kempen, Germany

Ralf Gordon Conrads