Koninklijke Philips Corporation N.v.

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Ralf Dorscheid

Gereon Vogtmeier

Roger Steadman

Herfried Karl Wieczorek

Andreas Goedicke

Jeroen Jonkers

Andreas Brauers

Christian Drabe

Alexander Wolter

Michael Schaaf

Andreas Bergmann

Wolfgang Eckenbach

Michael Schaff

Frank Johnen

Petra Graetz

Andreas G Goedicke

It is described a low ohmic Through Wafer Interconnection (TWI) for electronic chips formed on a semiconductor substrate (). The TWI comprises a first connection extending between a front surface and a back surface of the substrate (). The first connection () comprises a through hole filled with a low ohmic material having a specific resistivity lower than poly silicon. The TWI further comprises a second connection () also extending between the front surface and the back surface. The second connection () is spatially separated from the first connection () by at least a portion of the semiconductor substrate (). The front surface is provided with a integrated circuit arrangement () wherein the first connection () is electrically coupled to at least one node of the integrated circuit arrangement () without penetrating the integrated circuit arrangement (). During processing the TWI the through hole may be filled first with a non-metallic material, e.g. poly silicon. After forming integrated components () on top of the front surface the substrate () may be thinned and the non-metallic material may be substituted with the low ohmic material, which is in particular a metallic material.

Low ohmic through substrate interconnection for semiconductor carriers

In a disclosed imaging method, the instantaneous speed or data acquisition dwell times of a detector head is optimized as a function of position along a path of the detector head around a subject. The optimization is respective to an expected radioactive emission profile of a region of interest that is less than the entire subject. The detector head is traversed along the path using the optimized instantaneous speed or data acquisition dwell times. During the traversing, imaging data are acquired using the detector head. The acquired imaging data are reconstructed to generate a reconstructed image of at least the region of interest. A gamma camera configured to perform the foregoing imaging method is also disclosed.

Cardiac SPECT system with trajectory optimization

A grid () for selective transmission of electromagnetic radiation and a method for manufacturing such grid is proposed. Therein, the grid () comprises a structural element with walls () comprising a plurality of particles () of a radiation-absorbing material wherein the particles () are sintered together such that pores () are present between neighboring particles (). The pores () are at least partially filled with a second solid material. The filling of the pores () can be done by inserting the second material in a liquid, preferably molten form into the pores. The second material can be itself radiation-absorbing as well and may help to both, increase the mechanical stability of the grid and to enhance the radiation-absorbing properties.

Grid and method of manufacturing a grid for selective transmission of electromagnetic radiation, particularly X-ray radiation

The invention relates to semiconductor substrates and methods for producing such semiconductor substrates. In this connection, it is the object of the invention to provide semiconductor substrates which can be produced more cost-effectively and with which a high arrangement density as well as good electrical conductivity and closed surfaces can be achieved. In accordance with the invention, an electrically conductive connection is guided from its front side through the substrate up to the rear side. The electrically conductive connection is completely surrounded from the outside. The insulator is formed by an opening which is filled with material. The inner wall is provided with a dielectric coating and/or filled with an electrically insulating or conductive material. The electrically conductive connection is formed with a further opening which is filled with an electrically conductive material and is arranged in the interior of the insulator. The openings are formed with step-free inner walls aligned orthogonally to the front side or tapering continuously in the direction of the rear side.

Semiconductor substrate and methods for the production thereof

In a disclosed imaging method, the instantaneous speed or data acquisition dwell times of a detector head () is optimized as a function of position along a path (P) of the detector head around a subject (S, SS, SXL). The optimization is respective to an expected radioactive emission profile (EPROI) of a region of interest (H, HS, HXL) that is less than the entire subject. The detector head is traversed along the path using the optimized instantaneous speed or data acquisition dwell times (). During the traversing, imaging data are acquired using the detector head. The acquired imaging data are reconstructed to generate a reconstructed image of at least the region of interest. A gamma camera () configured to perform the foregoing imaging method is also disclosed.

In order to provide a simple and reliable monitoring technique for a number of different parameters of a patient in a bed (), a system () is provided, said system () comprising: at least one first sensor device () adapted to measure a first force component acting in a first direction (), said first force component corresponding to a first parameter of the patient, at least one second sensor device () adapted to measure a second force component acting in a second direction (), said second force component corresponding to a second parameter of the patient, and a data device () adapted to acquire the measured data from the at least one first sensor device () and the at least one second sensor device () and to process those data in order to provide information about the number of parameters of the patient.

System for monitoring a number of different parameters of a patient in a bed

The invention relates to a device for the detection and/or transmission of radiation, particularly an X-ray detector, that consists of a carrieron which an array of detector modulesis arranged. The carriercomprises holesthrough which a ball at the backside of the detector modulescan be inserted in order to fix the modules such that they can still rotate to a certain degree. Due to this freedom, the sensor modulescan align themselves during assembly.

Modular device for the detection and/or transmission of radiation with self-aligning modules

The invention relates to the production of a scintillator system which comprises an Anti-Scatter-Grid () and an arrangement of scintillator cells. In a first processing step, a rectangular pattern of slots () is cut into the top surface of a scintillator crystal (). An Anti-Scatter-Grid () is then inserted with one end into said slots and fixed there with a glue. Finally, the top layer (thickness d) is separated from the scintillator crystal () yielding the desired scintillator system.

Arrangement of a scintillator and an anti-scatter-grid

The present invention relates to a detector, in which detector modules are two-dimensionally arranged. The problem of the two-dimensional arrangement of detector modules is solved by a base structure () with guide elements () on which the detectors modules () with at least one respective guide structure (), are positioned relative to at least one of the respective guide elements, the guide elements () extending in a first direction (R), at least two of the detector modules () being positioned consecutively on one of the guide elements () in the first direction (R), and there are guide elements () that are separated from one another in a second direction (R).

Radiation detector module

The invention relates to an arrangement for collimating electromagnetic radiation, comprising a macrocollimator which has at least two cutouts, and microcollimator structures which are positioned in the cutouts of the macrocollimator and have lamellae that absorb electromagnetic radiation, so that collimator channels are formed which in each case extend such that they are transparent in a transmission direction.

Arrangement for collimating electromagnetic radiation

The invention relates to a detector for the detection of electromagnetic radiation, which detector includes at least one scintillator (), at least one CMOS chip () and a ceramic basic element (), a respective intermediate layer () that is free from bubbles and defined in respect of its gap width being provided each time between the scintillator () and the CMOS chip () and between the CMOS chip () and the ceramic basic element (), the intermediate layer () containing at least two adhesives (A, B) of different consistency and spacers ().

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Kerkrade, Netherlands

Ralf Dorscheid