Siemens Aktiengesellschaft

Infineon Technologies Ag

Ralf Dietrich

Werner Spaeth

Wolfgang Gramann

Hans-Ludwig Althaus

Georg Bogner

Martin Weigert

Holger Karstensen

Erich Hufgard

Gerhard Franz

Franz Mayerhofer

Mathias K&auml;mpf

A photo-optical transmitter assembly is produced in the following manner: a glass wafer is fixed onto a transparent submount and a V-shaped recess is subsequently created between optical prism elements using targeted sawcuts. A rod-shaped element with a reflective coating is inserted into the V-shaped recess. A laser beam from a semiconductor laser is thus deflected by 90&deg; on the rod-shaped element with the reflective coating and traverses the submount.

Method for fabricating an optical transmitting subassembly

An optoelectronic transducer includes a base plate, a radiation-emitting or transmitting semiconductor component disposed on the base plate, an optical lens system aimed at the semiconductor component and a spacer joined to the base plate for the lens system. The base plate, the spacer and the lens system are formed of materials with at least similar coefficients of thermal expansion. A method for producing an optoelectronic transducer includes forming indentations in a base plate for receiving semiconductor components, while leaving a land remaining on at least one side of each of the indentations. A first plate of the size of the base plate is placed on the lands and joined to the lands by material locking. The first plate is removed between the lands producing spacers joined to the base plate. A number of the semiconductor components are inserted into the indentations in accordance with a predetermined grid pattern and are joined to the base plate to form substrates. The substrates are covered with a second plate including a number of lens systems correspopnding to number of semiconductor components, while placing the lens systems of the second plate in the same grid pattern. The second plate is adjusted relative to the substrates for aiming each of the lens systems at a respective one of the semiconductor components. The second plate is secured to the substrates.

Optoelectronic transducer formed of a semiconductor component and a lens

An optoelectronic transducer has a radiation-emitting and/or radiation-receiving body on a carrier unit. The carrier unit has a mounting surface provided with a number of terminal parts. The terminal parts are provided with electrical terminal areas defining a contacting plane. The distance of the contacting plane from the mounting surface is greater than a maximum height of the body from the mounting surface, including all optional electrical conductors and covers.

Surface mountable optoelectronic transducer and method for its production

In an optoelectronic component having a laser chip as a light transmitter and a lens coupling optics for defined emission of radiation generated in the laser chip, the lens coupling optics is arranged immediately in front of the laser chip and is adjusted and fixed in stable fashion in a simple way. The component is rationally manufactured in a wafer union. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers, and that are inclined at an angle of 45.degree. relative to the resonator faces. Thus the radiation generated in the laser chip is directed nearly perpendicularly upward to the surface of the common carrier and the lens coupling optics is arranged on at least the one carrier part such that the radiation generated in the laser chip impinges this lens optics nearly perpendicularly.

Optoelectronic component and method for the manufacture thereof

A method for dry etching of a semiconductor substrate includes producing convex structures on a surface of a semiconductor wafer by using a suitable masking and a suitable etchant. A thick photoresist layer is applied to a semiconductor wafer and structured. The structured photoresist layer is liquified by the influence of temperature to produce a spherical structure and is then hardened as an etchable masking. The semiconductor wafer structured with the photoresist layer is etched in plasma at etching speeds being similar for the semiconductor material and the photoresist, for transferring a convex structure of the photoresist layer to the semiconductor wafer, during etching down of the photoresist layer.

Method for dry etching of a semiconductor substrate

A bidirectional transceiver module for message and signal transmission via a light waveguide is formed of a lens coupling optics, a laser chip as a light transmitter, a light receiver, and a beam splitter intervening in the beam path. These parts are at least partially surrounded by a housing. They are designed such that, given reduced manufacturing expense, a lens coupling optics arranged immediately in front of the laser chip can be adjusted in a simple way and can be fixed in stable fashion. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers and are inclined at an angle of approximately 45.degree. relative to the resonator faces for beam deflection onto the lens coupling optics secured above the laser chip on at least one carrier part. The mirror layer neighboring the front side of the laser chip is provided with the beam splitter. The light receiver or an optical coupling for this is provided at the underside of the common carrier.

Transmission and reception module for a bidirectional, optical message

An opto-electronic transducer having a lens-type optical coupling wherein a lens within a lens carrier is arranged in the beam path immediately in front of the transducer. The lens carrier, together with the lens, are fixed to a fastening part by a fastening layer that is adjusted relative to the beam axis of the transducer. The fastening part is part of a common carrier for the transducer. The opto-electronic transducer and the lens carrier together with the lens are secured on the common carrier in such a spacial relationship relative to one another that the beam axis of the transducer is perpendicular to the surface formed by the fastening layer. The opto-electronic transducer of the invention is particularly suited for use as a light waveguide transmission or reception component or, alternatively, as an individual light source.

Opto-electronic transducer arrangement having a lens-type optical

An optical coupling element having a convex, refractive microlens is characterized by a ball having a flat, planar surface being mounted in a through-hole of a carrier lamina with the flat, planar surface extending parallel to a planar surface of the lamina. The coupling element is preferably made by a method which involves forming a through-hole in a lamina, mounting a ball in the through-hole, processing a surface of the ball to form the planar surface that extends parallel to a surface of the lamina. Preferably, a plurality of coupling elements are formed by providing a plurality of through-holes in an enlarged carrier and after processing, each individual coupling element is then separated from this enlarged carrier.

Growing community of inventors

Munich, Germany

Ralf Dietrich