E.g.o. Elektro-geraetebau Gmbh

Ralf Diehlmann

Volker Block

A circuit (1) includes a plate-shaped substrate (2), a thick-film conductor array (8) having first contact parts (11), with which second contact parts (13) of connecting leads (15) are connected two-dimensionally by a compression bond. The second contact parts (13) are configured tape-like by compression from a copper strand. An additional, non-conducting positional seal (30) of a potting compound (31) positively locates the connecting leads (15) in position with respect to the substrate (2), as a result of which very high currents can be handled at very high operating temperatures by simple means.

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Munich, Georgia

Ralf Diehlmann