Robert Boschgmbh

Robe It Bosch Gmbh

Ralf Boessendoerfer

Jochen Reinmuth

Joerg Muchow

Frank Schatz

Mirko Hattass

Axel Franke

Timo Schary

Kerrin Doessel

Janine Riedrich-Moeller

Jan Waldmann

Josip Mihaljevic

Alexander Eberspaecher

A method for manufacturing a microelectromechanical structure. The method includes: forming a first and a second functional layer including recesses, a third functional layer, and three insulating layers situated therebetween, a structured lateral area of the third functional layer defining a movable structure, the insulating layers and the first and second functional layers each including a lateral area situated beneath the structured lateral area of the third functional layer and corresponding to a perpendicular projection of the structured lateral area; etching the insulating layers to remove the lateral area of the third insulating layer, and expose the movable structure, all recesses of the first functional layer situated in the lateral area of the first functional layer being formed by narrow trenches, the first functional layer being formed to include an electrically insulated segment in the lateral area which is separated from the remainder of the first functional layer by trenches.

Method for manufacturing a microelectromechanical structure and microelectromechanical structure

A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.

Micromechanical component and method for producing a micromechanical component

A micromechanical z-inertial sensor, having a movable MEMS structure developed in a micromechanical function layer; a torsion spring connected to the movable MEMS structure; and a spring device connected to the torsion spring, the spring device being developed to hamper a deflection of the torsion spring orthogonal to a sensing direction of the MEMS structure in a defined manner.

Micromechanical z-inertial sensor

A micromechanical component is described including a substrate having a spacer layer and a test structure for ascertaining the thickness of the spacer layer. The test structure includes a seismic mass, which is elastically deflectable along a measuring axis parallel to the substrate, a first electrode system and a second electrode system for deflecting the seismic mass along the measuring axis, having a mass electrode, which is produced by a part of the seismic mass, and a substrate electrode, which is situated on the substrate in each case, the first electrode system being designed to be thicker than the second electrode system by the layer thickness of the spacer layer.

Micromechanical component having a test structure for determining the layer thickness of a spacer layer and method for manufacturing such a test structure

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Dinkelsbuehl, Germany

Ralf Boessendoerfer