Advanced Micro Devices Corporation

Momentum Technical Consulting, Inc.

Ralf B Lukner

Peter J Beckage

Keith A Edwards

Wonhui Cho

Owen Hehmeyer

An apparatus and method for detecting a process endpoint. The method includes receiving a first data signal and a second data signal and combining the first data signal and the second data signal to generate a combined data signal. The method also includes detecting a peak in the combined data signal, wherein the peak indicates the process endpoint. The apparatus includes a data collection unit capable of receiving a plurality of data signals and a signal analysis unit. The signal analysis unit is capable of combining the plurality of data signals received through the data collection unit to generate a combined data signal and identifying a peak in the combined data signal indicative of the process endpoint.

Method and apparatus for detecting a process endpoint

During a CMP operation, vibration-caused variations in the forces holding a wafer against a polishing pad, and/or relatively moving the pad and the wafer are measured and the standard deviation thereof is used to minimize or eliminate the deleterious effects of the vibrations.

Method of and apparatus for chemical-mechanical polishing

The invention, in a first aspect, includes a method and apparatus for detecting the endpoint in a chemical-mechanical polishing process. The first aspect includes a chemical-mechanical polishing tool modified to receive a first and a second data signal; combine the first and second data signals to generate a combined data signal; and detect a peak in the combined data signal, wherein the peak indicates the process endpoint. In a second aspect, the invention is a method and an apparatus for detecting the endpoint in a chemical-mechanical polishing process. The second aspect includes an apparatus implementing a method in which a data signal is received. The data signal is analyzed to detect a peak indicative of the process endpoint in the received data signal. The peak detection includes determining a high value for an initial peak; determining a low value for a following trough; estimating a value for the endpoint process from the high value and the low value; performing a least squares fit on the received data signal to identify subsequent peaks therein; filtering out a subsequent peak less than the estimated value; and identifying a remaining subsequent peak as the process endpoint. One particular embodiment includes both of these aspects.

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Austin, TX, United States of America

Ralf B Lukner