Kulicke and Soffa Industries, Inc.

Kulicke and Soffa Investments, Inc.

Other

Rakesh Batish

Andrew F Hmiel

Walt VonSeggern

C Scott Kulicke

Glenn Sandgren

Lewis Sharps

A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors per layer providing interconnection between elements in the multi-tier wire bonded semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across only a portion of at least two of said plurality of conductors.

System for reducing or eliminating semiconductor device wire sweep

A system for transporting and positioning a patient onto an operating room table from a movable transportation device, e.g., a stretcher, to be located immediately laterally of the operating room table and transporting back onto the movable transportation device after the surgery. The system basically comprises a first and second inflatable assemblies to effect the pivoting of the patient about a longitudinal axis extending between the table and stretcher from a supine position on the stretcher to a horizontal prone position on the table. A third inflatable assembly causes the patient's spine to be in an arcuate orientation suitable for spinal surgery.

Transport and positioning system for use in hospital operating rooms

A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulating the conductors and elements, thereby packaging the semiconductor device.

System and method for reducing or eliminating semiconductor device wire sweep

A method of packaging a semiconductor device including a plurality of elements is provided. The method includes applying an insulative material to at least a portion of the semiconductor device, where the insulative material includes insulative particles having a diameter smaller than a gap between adjacent conductors providing interconnection between the elements. The method also includes curing the insulative material.

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Royersford, PA, United States of America

Rakesh Batish