Opnext Japan, Inc.

Raju Kankipati

Mitsuo Akashi

Hirofumi Nakagawa

Fumitoshi Goto

Hironori Saitoh

The printed circuit board with the respective components of the optical transmitter-receiver mounted thereon is split into several parts, the fixing position of which respective parts with regard to the housing is set according to the standardized size of the respective components and which respective parts are interconnected through an electric connector and so forth, which makes the height of the transmitter-receiver lower. The split circuit boards are overlapped such that they make no contact with one another so as to enlarge the area of the circuit boards or practically increase the packaging area of the respective components, which realizes the structural compactness of the optical transmitter-receiver. The packaging side of the respective components is selected in an arbitrary manner according to the cooling direction of the respective ICs, which allows such direction to be oriented to the side of the heat sinks so as to enhance cooling behavior. When deteriorated parts are found, only the circuit board with such parts mounted is removed for repair or replacement, resulting in improving productivity and reducing production cost.

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Yokohama, Japan

Raju Kankipati