Applied Materials, Inc.

Rajkumar Thanu

Jeff Hudgens

Damon Keith Cox

Jeffrey C Hudgens

Karuppasamy Muthukamatchy

Prerna Sonthalia Goradia

David Fenwick

Geetika Bajaj

Karuppasamy Muthukamatchi

Darshan Thakare

Gayatri Natu

XiaoMing He

Sanni Seppaelae

Arun Dhayalan

Jennifer Y Sun

Charles T Carlson

Jason M Schaller

Benjamin B Riordon

Luke W Bonecutter

Matvey Farber

Alexander Berger

Karthik Balakrishnan

William P Laceky

Paul L Korff

Eran Weiss

Narayanan Ramachandran

Chandrakant M Sapkale

Jennifer Sun

Disclosed herein are multi-turn drive assemblies, systems and methods of use thereof. The multi-turn drive assemblies enable a robot link member to have a maximum rotation of at least 360 degrees about an axis. The multi-turn drive assemblies can be incorporated into a robot arm for enabling 360 degrees rotation of one or more link members about an axis. The robot arm may be located in a transfer chamber of an electronic device processing system. Also disclosed are methods of controlling the multi-turn drive assemblies and related robots.

Multi-turn drive assembly and systems and methods of use thereof

A robot apparatus is configured to extend a first end effector into a first process chamber and extend a second end effector into a second process chamber. The first process chamber and the second process chamber are separated by a first pitch. The robot apparatus is further configured to retract the first end effector and the second end effector into a rectangular mainframe while maintaining a distance between the substrates bounded by the first pitch throughout a retraction process, and fold the first end effector and the second end effector inward within a sweep diameter defined by a width of the rectangular mainframe.

Operations of robot apparatuses within rectangular mainframes

Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft counter-rotatable with the first shaft. The transfer apparatus may include an eccentric hub extending at least partially through the central hub, and which is radially offset from a central axis of the central hub. The transfer apparatus may also include an end effector coupled with the eccentric hub. The end effector may include a plurality of arms having a number of arms equal to the number of substrate supports of the plurality of substrate supports.

Robot for simultaneous substrate transfer

Disclosed in some embodiments is a chamber component (such as an end effector body) coated with an ultrathin electrically-dissipative material to provide a dissipative path from the coating to the ground. The coating may be deposited via a chemical precursor deposition to provide a uniform, conformal, and porosity free coating in a cost effective manner. In an embodiment wherein the chamber component comprises an end effector body, the end effector body may further comprise replaceable contact pads for supporting a substrate and the contact surface of the contact pads head may also be coated with an electrically-dissipative material.

Ultrathin conformal coatings for electrostatic dissipation in semiconductor process tools

A robot apparatus may include an upper arm adapted to rotate about a first rotational axis and a forearm rotatably coupled to the upper arm at a second rotational axis. A first wrist member may be rotatably coupled to the forearm at a third rotation axis. A second wrist member may be rotatably coupled to the forearm at the third rotation axis. A first end effector may be coupled to the first wrist member and a second end effector may be coupled to the second wrist member. The first wrist member and the second wrist member may be configured to rotate about the third rotational axis between a first pitch and a second pitch as a function of extension of the robot apparatus. Other apparatus and methods are disclosed.

Robot apparatus including dual end effectors with variable pitch and methods

A robot device includes a first link and a second link coupled to the first link via an elbow. One or more of the first link or the second link rotates about an axis of the elbow. The robot device further includes a generator disposed in the elbow. The generator is configured to generate electrical power based on relative angular mechanical movement associated with the elbow. The robot device further includes an end effector configured to transport a substrate within a substrate processing system. The end effector is disposed at a distal end of the second link. The end effector is to receive the electrical power generated by the generator.

Generating electric power for a robotic end effector

Methods, systems, and devices including a robot apparatus with at least one lower arm configured to rotate about a first rotational axis and at least one upper arm rotatably coupled to the at least one lower arm at a second rotational axis that is spaced away from the first rotational axis. The robot apparatus further include a first end effector coupled to the upper arm. The robot apparatus further includes a second end effector coupled to the at least one upper arm. The robot apparatus is suitable for accommodating varying pitches between two adjacent processing chambers or between two adjacent load lock chambers. The robot apparatus may operate in dual substrate handling mode, single substrate handling mode, or a combination thereof. The robot apparatus may also be an off-axis robot.

Vacuum robot apparatus for variable pitch access

A robotic handling system includes a transfer chamber and a robot arm disposed within the transfer chamber with an end effector having a longitudinal axis. The end effector includes a first wafer pocket defined within the end effector at a first location and a second wafer pocket defined within the end effector at a second location along the longitudinal axis. A first chamber, coupled to the transfer chamber, is reachable by the first wafer pocket and by the second wafer pocket. A second chamber, coupled to the first chamber, where the first chamber is positioned between the transfer chamber and the second chamber, and the second chamber is reachable by the first wafer pocket but not the second wafer pocket.

Long reach vacuum robot with dual wafer pockets

A processing system includes a robot arm with an end effector having a longitudinal axis, the robot arm having a reach of at least 45 inches, wherein the end effector includes: a first wafer pocket defined within the end effector at a first location along the longitudinal axis, wherein the first wafer pocket has the reach of at least 45 inches; and a second wafer pocket defined within the end effector at a second location along the longitudinal axis, wherein the second wafer pocket has a second reach that is less than 45 inches. The end effector is capable of concurrently carrying a first wafer in the first wafer pocket and a second wafer in the second wafer pocket.

Embodiments described herein generally relate to an apparatus and method of performing a robot calibration process within a substrate processing system. In one embodiment, a calibration device is used to calibrate a robot having an end effector. The calibration device includes a body, a first side and a second side opposite to the first side. The calibration device further includes a sensor disposed on the second side of the body. In some embodiments, the sensor covers the entire second side of the body. In this configuration, because the sensor covers the entire second side of the body of the calibration device, the calibration device can be utilized to sense the contact between the sensor and various differently configured chamber components found in different types of processing chambers or stations disposed within a processing system during a calibration process performed in each of the different processing chambers or stations.

Growing community of inventors

Santa Clara, CA, United States of America

Rajkumar Thanu