Semiconductor Components Industries, LLC

Motorola Corporation

Rajesh Srinivasan

Prosanto K Mukerji

Ronald E Thomas

Colin B Bosch

Michael John Seddon

James H Knapp

George W Hawkins

Peter J Gillespie

Laura J Norton

A semiconductor component includes a semiconductor chip (,) having first and second surfaces opposite each other, a semiconductor device (,) in the semiconductor chip (,), and a flexible substrate (,) packaging the semiconductor chip (,).

Flexible substrate for packaging a semiconductor component

A method of manufacturing a semiconductor component includes applying an encapsulant (211) to a wafer (210, 430), degassing the encapsulant (211), and separating the wafer (210, 430) into a plurality of semiconductor components. Manufactured in this manner, the encapsulant (211) of the semiconductor component is substantially devoid of air bubbles and voids.

Semiconductor component and method of manufacture

An encapsulant (17) is applied to a semiconductor wafer (16). The bottom surface (28) of the wafer (16) is held substantially planar while curing the encapsulant (17). The bottom surface (28) is held against a substantially planar support plate (12) to facilitate holding the wafer (16) substantially planar. A polisher plate (18) is pressed against the encapsulant (17) to assist ensuring that the encapsulant has a substantially smooth surface and substantially uniform thickness.

Semiconductor encapsulation method

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Scottsdale, AZ, United States of America

Rajesh Srinivasan