Globalfoundries Singapore Pte. Ltd.

Vanguard International Semiconductor Singapore Pte. Ltd.

Rajesh Sankaranarayanan Nair

Donald Ray Disney

Lulu Peng

Lawrence Selvaraj Susai

Rakesh Kumar

You Qian

Humberto Campanella Pineda

Integrated circuits (ICs) and method for forming IC devices are presented. In one embodiment, a method of forming a device with an integrated magnetic component using 3-dimensional (3-D) printing is disclosed. The method includes providing a substrate with a base dielectric layer, the base dielectric layer serves as a base for the integrated magnetic component. A first metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A magnetic core is formed on the substrate by spray coating magnet powder over the substrate and performing selective laser sintering on the magnet powder. A second metal layer is formed on the substrate by spray coating metal powder over the substrate and performing selective laser melting on the metal powder. A patterned dielectric layer separates the first and second metal layers and the magnetic core.

3-dimensional printing process for integrated magnetics

A device, such as a MEMS device, with stress tuning to achieve a desired stack stress across the wafer. The stress tuning includes trimming a stress compensation layer over a target layer having different stresses in different target layer regions. The trimming may include ion beam trimming to produce a stress compensation layer having different thicknesses over the different target layer regions to balance the stress of the target layer to a desired stress. The desired stress may result in almost zero residual stress to produce an almost flat MEMS device.

Devices with localized strain and stress tuning

Growing community of inventors

Singapore, Singapore

Rajesh Sankaranarayanan Nair