Nxp B.v.

Stichting Imec Nederland

Rajesh Mandamparambil

Mustafa Acar

Antonius Hendrikus Jozef Kamphuis

Jan Willem Bergman

Paul Mattheijssen

Philipp Franz Freidl

Dominicus Martinus Wilhelmus Leenaerts

Amar Ashok Mavinkurve

Chuan Nie

Marcellinus Johannes Maria Geurts

Andrei-Alexandru Damian

Arnoldus Joannes Hubertus Frijns

Jacob Marinus Jan Den Toonder

Marcel Arie Günther Zevenbergen

Konstantinos Giannakidis

Erik Daniel Björk

One example discloses an on-chip shielded device, including: a planar structure including a substrate and a passivation layer; an electrical component formed within the substrate and coupled to an input signal path and an output signal path; a first shielding element positioned above the electrical component and the passivation layer; and a second shielding element positioned above the electrical component, the passivation layer and the first shielding element.

On-chip shielded device

A semiconductor device may include an antenna array and a grounding assembly configured to at least partially electrically shield the antenna array. The grounding assembly may include a first grounding layer comprising a first plurality of openings and a second grounding layer comprising a second plurality of openings. The second grounding layer may at least partially occlude the first plurality of openings of the first grounding layer when viewed from above the antenna array.

Grounding assembly for a semiconductor device

An integrated circuit comprising a package, phased antenna array and die. The die comprises a plurality of unit cells, wherein each unit cell is divided into quadrants. Each quadrant comprises a receiver terminal located on a first axis, and a transmitter terminal located on a second axis, wherein the first axis is orthogonal to the second axis, and there is mirror symmetry between the nearest neighbour quadrants in the unit cell. The package comprises a plurality of pairs of feed lines, each pair of feed lines comprising a receiver feed line and a transmitter feed line. The receiver feed line is connected to one of the receiver terminals and the transmitter feed line is connected to the transmitter terminal in the same die quadrant. The receiver feed line is orthogonal to the transmitter feed line. Each antenna element is coupled to a respective pair of feed lines.

Single die design for different polarizations

A semiconductor device comprising a substrate, a first integrated circuit package mounted on the substrate, the first integrated circuit package comprising a first antenna sub-array having a uniform pitch, and a second integrated circuit package mounted on the substrate, the second integrated circuit package comprising a second antenna sub-array having a uniform pitch. The second integrated circuit package is mounted adjacent to the first integrated circuit package to form a multi-package module having an antenna array formed of the first antenna sub-array and the second antenna sub-array, wherein the antenna array has a uniform pitch. Also provided is a method of manufacturing a multi-package module and a method of providing package-to-package grounding.

Semiconductor device having uniform multi-package antenna array and method of manufacture

The present disclosure relates to an arrangement for providing information about a flow rate of a fluid, comprising:

Arrangement for providing information on fluid flow rate

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Eindhoven, Netherlands

Rajesh Mandamparambil