Intel Corporation

Rajesh Kumar Neerukatti

Pramod Malatkar

Kyle Yazzie

Naga Sivakumar Yagnamurthy

Chia-Pin Chiu

Mohit Mamodia

Mark J Gallina

David C McCoy

Joseph Bautista

Michael Gregory Drake

Frank P Prieto

Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicatively coupled to the acoustic sensor, wherein the acoustic sensor is to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.

Mechanical failure monitoring, detection, and classification in electronic assemblies

Disclosed herein are integrated circuit (IC) packages with an electronic component having a patterned protective material on a face, as well as related devices and methods. In some embodiments, a computing device may include: an integrated circuit (IC) package with an electronic component having a protective material on the back face of the electronic component, where the protective material is patterned to include an area on the back face of the electronic component that is not covered by the protective material; a circuit board, where the IC package is electrically coupled to the circuit board; and a heat spreader, where the heat spreader is secured to the circuit board and in thermal contact with the area on the back face of the electronic component that is not covered by the protective material.

Integrated circuit packages with patterned protective material

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Tempe, AZ, United States of America

Rajesh Kumar Neerukatti