Dow Global Technolgoies LLC

Blue Cube IP LLC

Rajesh H Turakhia

John N Argyropoulos

George C Jacob

Marty J Null

Andreas Lutz

Debkumar Bhattacharjee

Jeffery L Reynolds

Ha Q Pham

Bill Z Dellinger

Gary Lee Jialanella

Felipe A Donate

David H Bank

Marvin L Dettloff

Ludovic Valette

Timothy A Morley

Carl J Marshall, Jr

Glenn G Eagle

Eric E Cole

Yanli Feng

Eric B Ripplinger

Martin Reimers

Radhakrishnan Karunakaran

Eva-Maria Michalski

Kwanho Chang

Nigel Shields

Gary A Hunter

Marcus Pfarherr

Bharati Balijepalli

Larissa Falsarella

Krishnan Karunakaran

Itaru Kudose

Nikhil K E Verghese

Cui-ping Chen

George Chennakattu Jacob

Jeff Reynolds

Nikhil KE Verghese

The present invention provides thermosetting resin pre-impregnated or infused fiber materials or prepregs comprising a fiber material of a heat resistant fiber, such as a continuous fiber material or a discontinuous chopped fiber mat, infused with a thermosetting resin mixture comprising (i) at least one liquid epoxy resin; (ii) at least one epoxy novolac resin, (iii) dicyandiamide and (iv) and an adduct of a cycloaliphatic amine and a liquid epoxy resin, wherein the dicyandiamide is dissolved in the adduct of a cycloaliphatic amine and a liquid epoxy resin. The prepreg or fiber material has a shelf life of at least 30 days at ambient temperature and pressure before its Initial Tg (DSC) rises above 40&#xb0; C.

Storage stable epoxy prepregs from dicyandiamide solutions and methods for making the same

Aspects of the present invention provide a one component epoxy adhesive composition having improved impact resistance at low temperatures, such as &#x2212;40&#xb0; C. or less. In a first aspect, the adhesive includes one or more epoxy resins; at least one polyurethane based toughener; at least one amphipathic block copolymer; and one or more epoxy curing agents. In a further, aspect epoxy adhesive compositions having improved wash off resistance are also provided.

Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance

A liquid epoxy resin composition having a reduced tendency to crystallize including at least one liquid epoxy resin having the following generic chemical Structure (I): where n is 0 or an integer of 1 or more; and wherein n=0 is in the range of between about 1 wt % and about 90 wt %; wherein; n=1 is in the range of between about 7 wt % and about 20 wt %; n=2 is in the range of between about 0.8 wt % and about 3 wt %; and n=3 and above is in the range of about 0 wt % and about 2 wt %. 

Liquid epoxy resin formulations

A polyamide composition comprising a reaction product of: a) an excess of a polyfunctional amine; b) a dimer fatty acid; and c) a monomer fatty acid is disclosed. The polyamide composition can be used as a hardener in epoxy resin formulations.

Polyamide hardeners for epdxy resins

The invention relates to a process comprising: (a) preparing a curable epoxy-anhydride thermoset composition; and (b) applying said curable epoxy-anhydride thermoset composition in a cured-in-place pipe rehabilitation process is disclosed. The cured-in-place pipe application utilized can generally be the 'Inversion Installation Method,' or the 'Pull-in Installation Method'. The invention also relates to a cured-in-place pipe that is prepared by this process.

Cured-in place pipe rehabilitation process

A hardener composition comprising: a) an amine component; and b) a glycol ether component comprising i) from 10 weight percent to 70 weight percent alkylene glycol phenyl ether; ii) from 25 weight percent to 80 weight percent dialkylene glycol phenyl ether; iii) from 5 weight percent to 20 weight percent trialkylene glycol phenyl ether, is disclosed. The hardener composition can be used in epoxy thermoset formulations.

Low emission epoxy curing agents

A thermoset resin, including the reaction product of: an epoxy resin mixture including at least one cycloaliphatic epoxy resins; a cycloaliphatic anhydride hardener; and a catalyst; wherein the reaction product has a glass transition temperature greater than or equal to 210&#xb0; C. Also disclosed is a process for forming a thermoset resin, including: admixing two or more epoxy resins and a cycloaliphatic anhydride hardener to form a curable composition, wherein the epoxy resins include at least one cycloaliphatic epoxy resin; thermally curing the curable composition at a temperature of at least 150&#xb0; C. to result in a thermoset resin having a glass transition temperature of at least 210&#xb0; C. Such curable compositions may include: 35 to 65 weight percent of an epoxy resin mixture having at least one cycloaliphatic epoxy resins; 35 to 65 weight percent of a cycloaliphatic anhydride hardener; and from greater than 0 to 10 weight percent of a catalyst.

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A two-component curable epoxy resin system is disclosed. The resin system includes an epoxy resin component containing at least 80% by weight of a polyglycidyl ether of a polyphenol that has an epoxy equivalent weight of up to about 200 and contains no more than 2% by weight of monohydrolyzed resin species. The system also includes a hardener mixture that has an amino hydrogen equivalent weight of from 35 to 90 and contains at least 90% by weight of a mixture of (i) from 5 to 75% of the combined weight of (i), (ii) and (iii) of one or more compounds that have at least two primary and/or secondary aliphatic amino groups and which have no phenolic groups; (ii) from 10 to 95% of the combined weight of (i), (ii) and (iii) of one or more aminophenol compounds that contain one or more primary and/or secondary aliphatic amino groups and at least one phenolic group and (iii) from 0 to 50% of the combined weight of (i), (ii) and (iii) of one or more phenolic compounds that contain two or more phenolic groups and do not contain primary or secondary amino groups. The epoxy resin component and hardener mixture are present in amounts sufficient to provide from 1.05 to 1.35 equivalents of aliphatic amine hydrogens per equivalent of epoxide groups provided by the epoxy resin component. The system has beneficial curing characteristics that make it useful for producing fiber-reinforced composites in a resin transfer molding process.

Thermosetting composition and process for preparing fiber-reinforced composites

A process for producing a proppant particulate substrate having a coating layer thereon including the step of blending a proppant particulate substrate with a powder coating composition at a temperature sufficient to cause the powder coating composition to coat the proppant particulate substrate with a powder coating; and a proppant particulate substrate coated by such a process.

Powder coated proppant and method of making the same

A curable epoxy resin composition comprising (a) at least one epoxy resin; (b) at least one curing agent; and (c) at least one high molecular weight poly(propylene oxide) poiyol toughening agent; and a process for preparing the curable epoxy resin composition.

Toughening agent for epoxy resin compositions

A windmill blade which comprises reinforcing fibers in a toughened resin matrix. The resin matrix is made from a composition which comprises (a) one or more epoxy resins and/or one or more epoxy vinyl ester resins, (b) one or more reactive diluents, and (c) at least one amphiphilic block copolymer. The amphiphilic block copolymer comprises at least two different polyether blocks and is present in the composition in an amount of from about 0.5% to about 10% by volume, based on the total volume of the matrix composition.

Windmill propeller blade and method of making same

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Lake Jackson, TX, United States of America

Rajesh H Turakhia