Applied Optoelectronics, Inc.

Rajesh Bikky

Klaus Alexander Anselm

Stephen Hu

Nahid Sultana

Jae Yoon Um

Greg Pickrell

Chia Chen David Wong

An improved scribe etch process for semiconductor laser chip manufacturing is provided. A method to etch a scribe line on a semiconductor wafer generally includes: applying a mask layer to a surface of the wafer; photolithographically opening a window in the mask layer along the scribe line; etching a trench in the wafer using a chemical etchant that operates on the wafer through the window opening, wherein the chemical etchant selectively etches through crystal planes of the wafer to generate a V-groove profile associated with the trench; and cleaving the wafer along the etched trench associated with the scribe line through application of a force to one or more regions of the wafer.

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Houston, TX, United States of America

Rajesh Bikky