General Electric Company

Transportation IP Holdings, LLC

Ge Global Sourcing LLC

Juniper Networks, Inc.

Rajendra Yammanuru

Andrew Louis Krivonak

Shreenath Shekar Perlaguri

Arunpandi Radhakrishnan

Theodore Clark Brown

Michael Jay Grutkowski

Brian Magann Rush

Naveenan Thiagarajan

Mark Allen Murphy

Jain Raj Vettuvazhy Puthenpurayil

Ravichandran V

Fluid control device

Electronics enclosure

A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.

Heat transfer chassis and method for forming the same

Heat spreader

A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.

A cooling system includes a heat sink to absorb heat that is generated by a component of a device, where the heat sink includes a base to dissipate the heat, and a group of fins via which the heat, that is dissipated by the base, is transferred; and an inverted heat sink to receive the heat via the fins. The inverted heat sink includes another base to prevent a portion of the heat, transferred into an environment where another component is located, from causing a temperature, of the environment, to increase above a threshold; a heat pipe to transfer another portion of the heat, not transferred into the environment, to a portion of the other base; and another group of fins to receive the other portion of the heat via the portion of the other base. The inverted heat sink is also to transfer the other portion of the heat to another environment to prevent a temperature, of the component, from increasing above another threshold.

Thermal management and control using an inverted heat-pipe with a common vapor chamber base

Growing community of inventors

Bengaluru, India

Rajendra Yammanuru