Applied Materials, Inc.

Motorola Corporation

Semiquest, Inc.

Other

Nexplanar Corporation

Lam Research Corporation

Cabot Microelectronics Corporation

Rajeev Bajaj

Daniel Redfield

Fred Conrad Redeker

Jason Garcheung Fung

Ashwin Chockalingam

Nag B Patibandla

Mahendra Christopher Orilall

Mayu Felicia Yamamura

Boyi Fu

Sivapackia Ganapathiappan

Hou Tee Ng

Gregory E Menk

Terrance Y Lee

Mario Dagio Cornejo

Barry Lee Chin

Yuchun Wang

Aniruddh Jagdish Khanna

Ashavani Kumar

Kapila P Wijekoon

Kasiraman Krishnan

Veera Raghava Reddy Kakireddy

Stan D Tsai

Robert E Davenport

Russell Edward Perry

Hung Chih Chen

Yingdong Luo

Venkat Hariharan

Amritanshu Sinha

Shijian Li

David K Watts

Sanjit K Das

Yutao Ma

Puneet Narendra Jawali

Uma Sridhar

Jui-lung Li

Ankit Vora

Janos Farkas

Diane Scott

William C Allison

Sung C Kim

Subramoney V Iyer

Sudhakar Madhusoodhanan

Nandan Baradanahalli Kenchappa

Jaime A Saravia

Boguslaw A Swedek

Manoocher Birang

Brian J Brown

Thomas H Osterheld

Shou-Sung Chang

Jianshe Tang

Yan Zhao

Yongqi Hu

Andreas Norbert Wiswesser

Haosheng Wu

You Wang

Hari N Soundararajan

Tony Kaushal

David A Chan

Tse-Yong Yao

Bret W Adams

Ranga Rao Arnepalli

Jiri Pecen

Herbert Elliot Litvak

Shi-Ping Wang

David H Mai

Rahul Surana

Melissa Freeman

Gary Lam

Yongsik Moon

Stephen C Jew

Savitha Nanjangud

John Watkins

John M White

Mei Yin Chang

Steven M Zuniga

Dominic J Benvegnu

Deenesh Padhi

Jeonghoon Oh

Fritz C Redeker

Olubunmi O Adetutu

Bo Zheng

Robert D Tolles

Daihua Zhang

Robert T Lum

Ping Huang

Timothy B Michaelson

Robert Kerprich

Richard Frentzel

William H McClintock

Brian Scott Lombardo

Yen-Chu Yang

Rajan Nagabushnam

Mark G Fernandes

Andrew Scott Lawing

Lei Ping Lai

Andrew Siordia

Adam Manzonie

Mark A Zaleski

Ajoy Zutshi

Zhonghui Alex Wang

A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.

Printing a chemical mechanical polishing pad

Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.

Techniques for combining CMP process tracking data with 3D printed CMP consumables

Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.

Integrated abrasive polishing pads and manufacturing methods

A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.

Additive manufacturing of polishing pads

Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

Apparatus and method of forming a polishing article that has a desired zeta potential

Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

CMP pad construction with composite material properties using additive manufacturing processes

Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.

Polishing pads with interconnected pores

Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements. Each polishing element comprises an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface to define a plurality of channels disposed between the polishing elements. Each of the polishing elements has a plurality of pore-features formed therein. Each of the polishing elements is formed of a pre-polymer composition and a sacrificial material composition. In some cases, a sample of the cured pre-polymer composition has a glass transition temperature (T) of about 80° C. or greater. A storage modulus (E′) of the cured pre-polymer composition at a temperature of 80° C. (E′80) can be about 200 MPa or greater.

Polishing pads for high temperature processing

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.

Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity

Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process. The structures described herein are formed from a plurality of printed layers. The structure comprises a first material domain having a first material composition and a plurality of second material domains having a second material composition different from the first material composition. The first material domain is configured to have a first rate of removal and the plurality of second material domains are configured to have a different second rate of removal when an equivalent force is applied to a top surface of the first material domain and the plurality of second material domains.

Structures formed using an additive manufacturing process for regenerating surface texture in situ

Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.

Anionic polishing pads formed by printing processes

In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.

Hydrophilic and zeta potential tunable chemical mechanical polishing pads

Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.

Polishing pads having selectively arranged porosity

Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.

Advanced polishing pads and related polishing pad manufacturing methods

Growing community of inventors

Fremont, CA, United States of America

Rajeev Bajaj