Qualcomm Incorporated

Square, Inc.

Rajat Mittal

Mehdi Saeidi

Ryan Michael Coutts

Arpit Mittal

Melika Roshandell

Hee Jun Park

Rajit Chandra

Mohammad Tamjidi

Emil Rahim

Madan Krishnappa

Vivek Sahu

Tao Xue

Paul Penzes

Peng Wang

Ronald Alton

Kambiz Samadi

Suresh Sugumar

Jeffrey Gemar

Ali Taha

Young Hoon Kang

Amy Derbyshire

Sachin Dileep Dasnurkar

Prashant Prabhu

Neha Karajgikar

Aaron Armstrong

Paul Ivan Penzes

Palkesh Jain

Taravat Khadivi

Ryan Coutts

A method includes: acquiring temperature values from a plurality of temperature sensors spatially distributed within a device; using the temperature values, calculating skin temperature values corresponding to each of the temperature sensors; comparing the skin temperature values to a first temperature threshold; in response to determining that at least one of the skin temperature values exceeds the first temperature threshold, measuring temperature over time; comparing the temperature over time to a second temperature threshold; and in response to determining that the temperature over time exceeds the second temperature threshold, reducing power consumption of the device.

Circuits and methods providing temperature mitigation for computing devices

Techniques for onboarding new service providers based on portable service provider attributes are described. In an example, a server computing device may determine service provider attribute(s) of a service provider associated with a first merchant and associate the service provider attribute(s) with a data entry corresponding to an identifier of the service provider in a database. The server computing device may subsequently receive, from a point-of-sale device operated by a second merchant, identification data associated with the service provider and may determine the identifier of the service provider based on the identification data. Based on the identifier, the server computing device may access the service provider attribute(s) associated with the service provider from the database and may update a second merchant service inventory associated with the second merchant based on the service provider attribute(s) of the service provider.

Onboarding new service providers utilizing portable service provider attributes

In one embodiment, a temperature management system comprises a plurality of thermal sensors at different locations on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the thermal sensors, to fit a quadratic temperature model to the received temperature readings, and to estimate a hotspot temperature on the chip using the fitted quadratic temperature model.

Thermal sensor placement for hotspot interpolation

A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.

Thermal arm for drone

The disclosure generally relates to a hybrid design whereby a heat spreader arranged to reduce an external skin temperature on a handheld device may further enable the external skin temperature to be directly measured. For example, the heat spreader may be thermally coupled to at least one external surface and include at least one region in which a plurality of recesses are formed such that an electrical resistance is produced in the at least one region when a current is applied thereto. The heat spreader may be formed from a material having a substantially linear resistance-to-temperature correlation, whereby the electrical resistance produced in the at least one region may be measured and correlated to a temperature on the at least one external surface.

Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurement

A thermal controller for managing thermal energy of a multi-core processor is provided. The cores include a first core processing a load and remaining cores. The thermal controller is configured to determine that a temperature of the first core is greater than a first threshold, determine a temperature of a second core of the remaining cores in response to determining that the temperature of the first core is greater than the first threshold, and determine whether the temperature of the second core is greater than or less than a second threshold. The thermal controller is configured to transfer at least a portion of the load of the first core to the second core in response to determining that the temperature of the first core is greater than the first threshold and based on whether the temperature of the second core is greater than or less than the second threshold.

Thermal mitigation of multi-core processor

Systems, methods, and computer programs are disclosed for reducing leakage power of a system on chip (SoC). One such method comprises monitoring a plurality of temperature differentials across a respective plurality of thermoelectric coolers on a system on chip (SoC). Each of the thermoelectric coolers is dedicated to a corresponding one of a plurality of chip sections on the SoC. The thermoelectric coolers are controlled based on the plurality of temperature differentials to minimize a sum of a combined power consumption of the plurality of chip sections and the plurality of corresponding dedicated thermoelectric coolers.

Systems and methods for reducing leakage power of a system on chip with integrated thermoelectric cooling

In one embodiment, a method of temperature control comprises receiving temperature readings from a temperature sensor on a chip, calculating one or more second derivatives of temperature with respect to time based on the temperature readings, and determining whether to perform temperature mitigation on the chip based on the one or more calculated second derivatives of temperature.

Systems and methods for detecting thermal runaway

A method includes generating temperature information from a plurality of temperature sensors within a computing device; and processing the temperature information to generate voltage reduction steps based on an observed rate of change of the temperature information.

Circuits and methods providing calibration for temperature mitigation in a computing device

A method, an apparatus, and a computer program product for performance management are provided. The apparatus may be an electronic device. The electronic device detects a change of form factor mode or ambient wind using a detection circuit or at least one sensor. The change of form factor mode may include at least one of folding the electronic device, unfolding the electronic device, rolling the electronic device, changing a flexible shape of the electronic device, or equipping a cover on the electronic device. A set of thermal control parameters may be determined based on the detected change. The set of thermal control parameters may be retrieved from a lookup table or calculated using a mathematical model. The electronic device adjusts the performance based on the set of thermal control parameters.

Adaptive thermal control and power budget

In one embodiment, a temperature management system comprises a plurality of temperature sensors on a chip, and a temperature manager. The temperature manager is configured to receive a plurality of temperature readings from the temperature sensors, to determine a plurality of power values based on the temperature readings, to determine a plurality of temperature values based on the determined power values, the determined temperature values corresponding to a plurality of different locations on the chip, and to estimate a temperature of a hotspot on the chip based on the determined temperature values.

Accurate hotspot detection through temperature sensors

An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.

Thermal modulation of an electronic device

A mobile device includes an exterior housing, a display, a capacitive sensor, a temperature sensor, and a controller. The capacitive sensor is coupled to the exterior housing at a backside of the mobile device and the temperature sensor is coupled to one or more components of the mobile device. The controller is coupled to the capacitive sensor and to the temperature sensor. The controller is configured to adjust a temperature threshold of the mobile device in response to detecting the presence of a case installed on the exterior housing. The controller is also configured to adjust one or more operating parameters of the mobile device to control a temperature of the exterior housing to below the temperature threshold based on the output of the capacitive sensor and one or more readings of the temperature sensor.

Mobile device with backside capacitive sensor for thermal management of an exterior housing

An apparatus includes a first circuit and a second circuit sharing an instruction stream. A voltage controller circuit is configured to provide an operation voltage and at least one low-power voltage to the second circuit independent of a supply voltage of the first circuit in response to a sequence of the instruction stream. In another aspect, a method of operating a power management function is presented. The method includes providing an instruction stream for a first circuit and a second circuit and providing selectively an operation voltage and at least one low-power voltage to the second circuit independent of a supply voltage of the first circuit in response to a sequence of the instruction stream.

Processor power management responsive to a sequence of an instruction stream

A package-on-package (PoP) device includes a first package, a second package, and a bi-directional thermal electric cooler (TEC). The first package includes a first substrate and a first die coupled to the first substrate. The second package is coupled to the first package. The second package includes a second substrate and a second die coupled to the second substrate. The TEC is located between the first die and the second substrate. The TEC is adapted to dynamically dissipate heat back and forth between the first package and the second package. The TEC is adapted to dissipate heat from the first die to the second die in a first time period. The TEC is further adapted to dissipate heat from the second die to the first die in a second time period. The TEC is adapted to dissipate heat from the first die to the second die through the second substrate.

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San Diego, CA, United States of America

Rajat Mittal