Intel Corporation

Rajashri Doddamani

Luke A Johnson

Ronald W Swartz

John Maddux

Jeffrey B Davis

Byungha Joo

Darshana Surti

Meetul Goyal

Eva Yim

Donald Rush

Duc G Nguyen

Methods and systems to calibrate an on-die resistor relative to an operating voltage of an on-die push-pull driver, and to calibrate the push-pull driver relative to the on-die resistor and relative to operating voltages of the push-pull driver. The calibrated on-die resistor may be used to calibrate receive terminations, a differential transmit termination, and a simulated far-end differential receive termination. The calibrated differential transmit termination and simulated far-end differential receive termination may be coupled in parallel to calibrate current drivers. Calibration of the current drivers may include calibrating voltage swing, and may include a first phase that simultaneously adjusts compensation to the current drivers, and a second phase that individually adjusts the compensation to the current drivers.

Methods and systems to calibrate push-pull drivers

Diffusion regions in a standard cell design are bridged across cell boundaries. Shallow trench isolation is reduced and nitride passivation thickness variation is reduced.

Shallow trench avoidance in integrated circuits

Growing community of inventors

Folsom, CA, United States of America

Rajashri Doddamani