Apple Inc.

Advanced Micro Devices Corporation

Rajasekaran Swaminathan

Jun Zhai

Rahul Kumar Agarwal

David A Secker

Ravindranath T Kollipara

Mahesh S Hardikar

Robert R Atkinson

Karthik Shanmugam

Deepak Vasant Kulkarni

Chintan Buch

Apparatuses, systems and methods for efficiently generating a package substrate. A semiconductor fabrication process (or process) fabricates each of a first glass package substrate and a second glass package substrate with a redistribution layer on a single side of a respective glass wafer. The process flips the second glass package substrate upside down and connects the glass wafers of the first and second glass package substrates together using a wafer bonding technique. In some implementations, the process uses copper-based wafer bonding. The resulting bonding between the two glass wafers contains no air gap, no underfill, and no solder bumps. Afterward, the side of the first glass package substrate opposite the glass wafer is connected to at least one integrated circuit. Additionally, the side of the second glass package substrate opposite the glass wafer is connected to a component on the motherboard through pads on the motherboard.

Glass core package substrates

Packages and packaging techniques are described in which a patterned carrier substrate can be used to create a reconstituted fanout substrate with a topography that can accommodate components of different thicknesses. In an embodiment, a wiring layer is formed directly on a multiple level topography of a molding compound layer including embedded components.

Package integration using fanout cavity substrate

The connector portion of a flex connector may be integrated into a socket, by forming a complete cutout in the socket in which the connector is located, or by forming the socket with a portion having a reduced thickness relative to the rest of the socket, with the connector being positioned in this portion of reduced thickness between the socket and an MLB. Another flex connector may be formed vertically above the first flex connector, mounted to the top surface of the package and clamped in place by a heat sink on top of the stack. Providing both top and bottom flex connectors may multiply the number of available connections for a given footprint. A heatsink positioned on top of the stack may include a spring assembly on a bottom portion to engage specified portions of the stack with a predefined force to ensure correct loading.

Socket with integrated flex connector

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Austin, TX, United States of America

Rajasekaran Swaminathan