Diversified Chemical Technologies, Inc.

Ford Global Technolgoies, LLC

Ciba Specialty Chemicals Corporation

Rajan Eadara

Roy Jacob

Joribeth E Joseff

Mooil Chung

David Wen-Lung Chang

Biju Philip

Yushin Ahn

Kirsen J Quan

Craig Rackers

Teruko Uchimi Miyazaki

James Edward Hoge

Dan Ondrus

Jeff Crist

Arnold Joseff

Anthony Konovaliv

Weichen Chi

Sunny K George

Patrick A Ohaka

Stephen Ludwig

Jori Joseff

Joribeth Joseff

An article is reinforced by applying to it a thermally curable composition of a resin mixture of 10% to 60% by weight of a diglycidyl ether of bisphenol-A, 5% to 25% by weight of an epoxy novolac, and 5% to 25% by weight of a reinforcement material comprising carbon fibers. Following application, the composition is cured. In some instances, at least a portion of the diglycidyl ether of bisphenol-A and/or the epoxy phenyl novolac resin may be adducted with an elastomer.

Sprayable, carbon fiber-epoxy material and process

A two layer sound deadening material is formed from pumpable material applied through a pair of extrusion heads mounted on a single mount. A robot, used in high speed mass production automotive assembly lines, moves the door panel relative to the stationary extrusion heads to allow the simultaneous application of the two layers onto the interior side of the door. The first layer is formed of a thermosetting composition containing epoxy, rubber and a catalyst and adheres directly to the door panel. The second layer is formed of a thermosetting composition containing an epoxy resin, a thermo plastic copolymer and a curative which will adhere directly to the first layer due to similar chemical structures. The second layer is positioned such that the edges thereof are inside of the corresponding edges of the first layer to prevent read through transmission of noise from the body or door panel.

Two layer pumpable sound deadener

A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.

Two component, curable, hot melt adhesive

The present invention provides a polymeric material and a process for making the polymeric material. The polymeric material has adhesive and noise abatement properties over a broad temperature range. Further, the material is chip and corrosion resistant and provides metal panel reinforcement.

Non-polyvinyl chloride, interpenetrating network epoxy/urethane acrylates

A radiation curable precursor coating composition for the preparation of a non-blocking, heat activatable adhesive includes a curable acrylic material, a curable elastomeric material, and a hydrocarbon tackifier material having a softening temperature ranging from approximately 50&deg; C. to approximately 200&deg; C., wherein when the acrylic material and the elastomeric material are cured, the coating composition is non-blocking at room temperature, but when the coating composition is heated to a temperature above both the softening temperature of the hydrocarbon tackifier and the Tg of the coating composition, the coating composition becomes adhesive.

Radiation-cured, non-blocking heat activated label adhesive and coatings and method for using same

The present invention pertains to a one component curable epoxy resin composition which is storage-stable at ambient temperature and which maintains a post-cured high glass transition temperature (Tg) of above 130.degree. C. and a low coefficient of thermal expansion (CTE) of less than 1.76.times.10.sup.-5 cm/cm/.degree.C. over a temperature range of -30.degree. to 125.degree. C., and thus finds practical utility in tooling applications. The epoxy resin composition comprises an epoxy resin or mixture thereof, a multifunctional epoxy resin diluent, a boron trichloride amine complex, and at least one filler selected from the group consisting of a silica or a silicate. The invention also relates to the cured product.

Room temperature storage-stable, heat-curable, low CTE, one component

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Ann Arbor, MI, United States of America

Rajan Eadara