Lam Research Corporation

Rajan Arora

Ye Feng

Steven T Mayer

Jorge Luque

Yassine Kabouzi

Seonkyung Lee

Wayne Tang

Jason Daniel Marchetti

James R Zibrida

Jason Shields

Michael Souza

Jared Herr

A large beam spot spectral reflectometer system for measuring a substrate is provided. Hardware components for collecting in situ large beam spot optical signals is disclosed. Machine learning models for denoising large beam spot optical signals are disclosed. Machine learning models for interpreting in situ optical data and facilitating process control are also disclosed.

Large spot spectral sensing to control spatial setpoints

In some examples, a wafer bow measurement system comprises a measurement unit including: a wafer support assembly to impart rotational movement to a measured wafer supported in the measurement unit; an optical sensor; a calibration standard to calibrate the optical sensor; a linear stage actuator to impart linear direction of movement to the optical sensor; a wafer centering sensor to determine a centering of the measured wafer supported in the measurement unit; and a wafer alignment sensor to determine an alignment of the measured wafer supported in the measurement unit.

Integrated wafer bow measurements

A metrology system for substrate processing includes an optical metrology station including a plurality of optical sensors to measure spectra from a plurality of measurement locations on a substrate. A plurality of fiber cables are connected to the plurality of optical sensors. A spectrometer is selectively connected to the plurality of fiber cables. A mass metrology station measures at least one of a mass or mass change of the substrate. A controller includes a modelling module to generate thickness values at the plurality of measurement locations based on the spectra from the plurality of measurement locations and a learned model. A spatial modelling module generates a spatial thickness distribution model for the substrate based on the thickness values at the plurality of measurement locations from the modelling module and the at least one of the mass or the mass change from the mass metrology station.

Systems and methods for combining optical metrology with mass metrology

Methods and apparatus for detecting the presence or absence of unwanted metal deposits on a substrate holder of an electroplating apparatus are described herein. In various embodiments, a plating sensor is used to detect unwanted metal deposits. The plating sensor may be mounted relatively far away from the area that it measures (e.g., the sensor target area). For instance, the plating sensor may be on one side of the electroplating apparatus (in some cases mounted on a drip shield), and the sensor target area may be on the opposite side of the electroplating apparatus. In this way, the plating sensor can measure across the electroplating apparatus. This placement provides a relatively deep depth of focus for the plating sensor, and provides some physical separation between the plating sensor and the electroplating chemistry. Both of these factors lead to more reliable detection results.

Remote detection of plating on wafer holding apparatus

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Hillsboro, OR, United States of America

Rajan Arora