Hamilton Sundstrand Corporation

Hs Elektronik Systeme Gmbh

Hs Elektronik System Gmbh

Rainer Seidel

Josef Maier

Norbert J Simper

Michael James Krenz

Eric W Karlen

Jeffrey T Wavering

John Horowy

Carl A Wagner

Peter Brantl

Michael William Foster

Debabrata Pal

Markus Greither

Bernd Loefflad

Richard Sinning

Matthias Maier

Pal Debabrata

Fritz Lammerer

The present invention relates to a power semiconductor chip module, comprising a substrate having a top side and a bottom side; at least one first power semiconductor device attached to the top side of the substrate; at least one first conductive structure thermally and electrically connecting the first power semiconductor device to the top side of the substrate; at least one second power semiconductor device attached to the bottom side of the substrate; and at least one second conductive structure connecting the second power semiconductor device to the bottom side of the substrate.

Power semiconductor chip module

A solid-state contactor includes a housing, a lead, a bus plate, and an end connector. The lead extends through the housing and into an interior of the housing. The bus plate is disposed within the housing interior and mounts a die which is electrically connected to the lead through the bus plate. The end connector extends between the bus plate and the lead, attaching to the bus plate at an angle for coupling a plurality of bus plates with die to the lead in a stacked arrangement.

Solid-state stacked die contactors

A solid state power controller including: a plurality of pairs of FETs connected in parallel, each pair comprising a first, forward-facing FET and a second, backward-facing FET connected by their respective sources; gate drive means for switching said FETs on and off; and means for isolating the sources of the backwards-facing FETs of the plurality of pairs of FETs from each other and operating the backwards-facing FETs in 3quadrant operation mode.

Solid state power controller

An electrical contactor assembly is provided including an electrical bus bar and at least one electrical contactor. The electrical bus bar includes a layer of insulation, a layer of copper, and a composite core having at least one wire embedded therein. The wire is configured to locally reduce thermal strain. The at least one electrical contactor is mounted to the layer of copper through an opening in the layer of insulation. The electrical contactor and the bus bar are thermally and electrically connected.

Heat sink for contactor in power distribution assembly

A solid state switch module is provided for use in a power distribution network including an input differential protection connection for receiving a measured current value from an upstream module. The solid state switch module also includes an output differential protection connection for sending a measured current value. The solid state switch module includes a trip outlet for sending a trip signal to an upstream solid state switch, and a trip inlet for receiving a trip signal from a downstream solid state switch. The trip inlet is operably coupled to the switch. A current sensor measures the current value of a connected power transmission line across the solid state switch module. A summer adds a current input from a parallel module with the current measures by the current sensor. A comparator determines whether an amount of current lost between the solid state switch module and an upstream module is acceptable.

Method for improving power distribution protection

A printed wiring board (PWB) includes a substrate having first and second opposing surfaces and a busbar coupled to the substrate. The busbar includes a power input connector and a cross-sectional dimension configured and disposed to carry at least 100 amperes. At least one semiconductor device is mounted to the busbar. The at least one semiconductor device includes an input electrically coupled to the busbar and an output. One or more output conductors are electrically coupled to the output of the at least one semiconductor device. The one or more output conductors include a cross-sectional dimension configured and disposed to carry at least 50 amperes.

Printed wiring board (PWB) for high amperage circuits

A solid state contactor assembly includes at least one solid state switch electrically connected to a first bus bar via at least one conductive plate. The solid state switch controls a flow of current between the first bus bar and a second bus bar. A current sensor is formed along a cross section of one of the first or second bus bar such that the current sensor separates its associated bus bar into two separate bus bar portions, and such that a flow of current between the two separate bus bar portions passes through the current sensor. A switch control is operable to control the solid state switch. The switch control is in communication with the current sensor.

Growing community of inventors

Tussenhausen, Germany

Rainer Seidel