Semikron Elektronik Gmbh &co.kg

Semikron Gmbh & Co., Kg

Semikron Elektronik Gmbh & Co. Kg Patentabteilung

Rainer Popp

Marco Lederer

Stefan Weiss

Thomas Hunka

Patrick Sturm

Harald Kobolla

Thomas Frank

Thomas Ziegler

Christian Göbl

Roland Bittner

Thomas Stockmeier

Christian Walter

Yvonne Manz

Klaus Backhaus

Christian Zeller

Markus Gruber

Alexander Popescu

Simon Hüttmeier

Stefan Weiß

Oliver Olbrich

A liquid cooling device with a main body has a planar surface for the arrangement of a power semiconductor device. This main body has a first end face and a second end face opposite said first one, and a plurality of tubular cooling recesses extending from the first to the second end face. A first swirling element arranged in an associated cooling recess, wherein the swirling element has an operative section arranged within the associated cooling recess and a locking section, wherein the locking section interacts with a locking abutment and/or with a further swirling element, and therefore prevents rotation of the operative section in the associated recess.

Liquid cooling device for the arrangement of a power semiconductor device

A module and a power semiconductor device wherein a module is configured with a molded plastic body and load terminal elements of the power semiconductor device, wherein respective load terminal elements are configured as a flat shaped metal body having a first main face and an opposite second main face, and having a first secondary face and an opposite second secondary face. The secondary faces connect the main faces, and have a terminal section, wherein the molded plastic body forms channels and comprises a bottom body part, a first and a second edge body and a partition body. The load terminal elements are arranged with a section in an associated channel, and an edge body of the channel has an indentation directed towards the one main face of the directly neighboring terminal element.

Module having a moulded plastic body and a multiplicity of load terminal elements and power semiconductor device therewith

Powercore module

A method for producing a power electronics system having a cooling device, a switching device, a terminal device, a capacitor device and a control device includes the following production steps: providing a cooling device with a plurality of first and second positioning cutouts; providing the switching device with a substrate and a first mounting device, which has first positioning devices; providing the terminal device, which is completely independent of the switching device, i.e. forms a dedicated component part or a dedicated assembly, with a second mounting device, which has second positioning devices; arranging the switching device on the cooling device, wherein the first positioning devices are arranged in the respectively assigned first positioning cutouts; arranging the terminal device on the cooling device, wherein the respective second positioning devices are arranged in the assigned second positioning cutouts; arranging the capacitor device.

Method for producing a power electronics system

The invention relates to a power semiconductor device having a pin element which passes through a housing opening, an elastic sealing device which is arranged between a housing opening wall of the housing, where the housing opening wall delimits the housing opening and encircles the pin element. The pin element runs through the sleeve and through a sealing device opening of the sealing element. The sealing device is not connected in a materially bonded manner to the sleeve, to the housing opening wall and to the pin element and the sealing device seals off the housing opening wall from the sleeve and seals off the sleeve from the pin element. A crosslinked potting compound is arranged on the sealing device. The crosslinked potting compound is connected in a materially bonded manner to the sleeve, to the housing opening wall and to the pin element and the potting compound seals off the housing opening wall from the sleeve and seals off the sleeve from the pin element.

Power semiconductor device comprising a housing, and method for producing a power semiconductor device

A power electronic subassembly having a housing and a capacitor arranged therein. The housing has an internally arranged cooling area, which is cooled by a cooling device integrated in the housing or an external cooling device. The capacitor has a contact device of a first polarity and a contact device of a second polarity and a capacitor busbar system. This capacitor busbar system comprises first and second sheet-like shaped metal bodies. The first metal body with the first contact device of the first polarity and the second metal body with the second contact device of the second polarity are electrically conductively connected. A first portion of the first metal body has a first subportion, which is arranged parallel to and at a distance from the cooling area, and a second subportion, which is in thermal contact with the cooling area, wherein the two subportions are connected by an intermediate portion.

Power electronic subassembly with capacitor

A power semiconductor module, for placement on a cooling component. The module includes a substrate, at least two power semiconductor components arranged on the substrate, a housing and outwardly routed load and control connections. The substrate has an insulator body with a first main area that faces the interior of the power semiconductor module, and has interconnects at load potential arranged thereon. Each load connection is formed as a shaped metal body with outer contacts, a strip-like section and with inner contacts extending from the strip-like section to the substrate and making circuit-compliant contact therewith. In addition, the load connections are substantially completely encased by insulation except in the vicinity of the outer and inner contacts and accordingly are electrically insulated from one another.

Power semiconductor module with connection elements electrically insulated from one another

A power semiconductor module having a substrate, a housing and a pressure device. The substrate further includes a body formed of an insulating material and structured conductor tracks which are arranged thereon and have load and auxiliary potentials. The substrate also includes recesses in the region of the structured conductor tracks in at least two areas that are not covered by a power semiconductor component. Furthermore, the pressure device has latching lugs, which are disposed in the recesses and are arranged therein in a form-fitting and/or frictional manner, at least two points on the side of the pressure device which faces the substrate.

Power semiconductor module having a substrate and a pressure device

A housing for a power semiconductor module in which load-connecting elements having contact devices are arranged. The contact devices are arranged in housing troughs on the exterior of the housing. The housing troughs are formed at an associated lateral wall of the housing. The housing is closed off by a cover. The housing is preferably formed as a unitary piece of material having a circumferential sealing frame and the cover includes an outer rim that extends over the circumferential sealing frame, to prevent the penetration of fluid or moisture into the power semiconductor module when the cover is closed. On its inner rim, each housing trough includes a sealing rib formed of a section of the sealing frame. The associated load-connecting element is crimped about the sealing rib, so that the contact device is disposed within the trough.

Housing for a power semiconductor module

A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The power module has at least one module board element and a housing formed with shafts for the pressure contact elements. The shafts open out from the housing base facing printed circuit board at opening orifices. The base is formed with orifice sealing ribs around the opening orifices. Moreover, the base of the housing may have a peripheral edge sealing rib along its outer edge. Furthermore, a sealing area element can be provided between the printed circuit board and the base of the housing.

Housing for a power module

A power semiconductor module in a pressure contact embodiment and a method for producing such modules, for disposition on a cooling component. Load terminals of the modules are formed as metal molded bodies having at least one contact element, one flat portion, and contact feet emanating therefrom. Each flat portion is disposed parallel to, and spaced from, the surface of the substrate. The contact feet extend from the flat portion to the substrate. An elastic intermediate layer is disposed between adjacent load terminals, in the region of the respective flat portions, and the intermediate layer and load terminals form a stack.

Power semiconductor modules and method for producing them

An arrangement with an associated production method, of a power semiconductor module in a pressure contact embodiment and a cooling component. The module includes load terminals embodied as metal molded bodies with a flat portion and a contact device originating at the flat portion, disposed within a housing. Each flat portion is disposed parallel to, and spaced from, the surface of the substrate. Contact feet extend from the flat portions to conductor tracks on the substrate. A pressure plate exerts pressure on the load terminals to hold them in place and establish electrical contact between the contact feet and the conductor tracks, while also establishing thermal contact between the load terminals and the cooling component. The cooling component, the housing, and the pressure plate form a first unit, which is mechanically decoupled from a second unit comprising the substrate and the load terminals.

Power semiconductor modules having a cooling component and method for producing them

A power semiconductor module in a pressure contact embodiment, for disposition on a cooling component, in which load terminals are formed as metal molded bodies, each with at least one flat portion and having a plurality of contact feet extending from the flat portion. Each flat portion of the load terminal is disposed parallel to, and spaced from, the substrate. The contact feet also extend from the flat portion to the substrate, where they form the contacts of the terminal elements. A molded insulation body is disposed between the flat portions of the load terminals and the substrate, and this molded insulation body has recesses for permitting the passage therethrough of the contact feet.

Pressure contact power semiconductor module

A power semiconductor module having an electrically insulating substrate, to be arranged with a circuit board. The circuit board is spaced apart from the substrate by a housing. First conductor tracks are disposed inside the substrate, facing the circuit board, for receiving power semiconductor devices which can be driven by a control IC device. Second conductor tracks are provided on the inside of the circuit board facing the substrate. In the housing, elastic connecting elements are pressure-contacted by a rigid pressure body to establish electrical connection between the first and second conductor tracks. An optimum electromagnetic compatibility is achieved due to the fact that IC conductor tracks and the control IC device are also provided on the inside of the substrate.

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Petersaurach, Germany

Rainer Popp