Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Technische Universitaet Berlin

Rainer Patzelt

Andreas Ostmann

Dionysios Manessis

Manuel Seckel

Thomas Löher

Alexander Neumann

The present invention relates to a method for the production of an expandable circuit carrier in which a starting material for an expandable substrate is applied on an electrically conductive foil which forms an expandable substrate layer which is connected to the foil, after which the foil is structured such that it forms a conductor structure having at least one expandable strip conductor. The present invention further relates to an expandable circuit carrier which can be produced by the method.

Expandable circuit carrier

A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.

Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate

Growing community of inventors

Berlin, Germany

Rainer Patzelt