Koninklijke Philips Corporation N.v.

Nxp B.v.

Rainer Moll

Joachim Heinz Schober

Michael Rabe

The invention relates to a lead-frame configuration with a frame base and multiplicity of lead-frames connected with the frame base, of which each lead-frame is intended to hold a chip, where each lead-frame has two connection plates of which each is intended to connect with a connection of a chip, where the two connection plates of each lead-frame delimit a bridging zone which can be bridged using a chip.

Lead-frame configuration for chips

In the case of a product () having a first product sub-part () and a second product sub-part (), the two product sub-parts () each comprise two connection zones () consisting of metal and of suitably thin construction for a crimping process and the connection zones () are connected together in pairs by means in each case of a crimp connection, in which the connection zones () of at least one product sub-part () exhibit the remnants (), remaining after performance of the crimping process, of elevations () present prior to performance of the crimping process.

Product comprising product sub-parts connected to each other by a crimp connection

In a data carrier (), or a module () for such a data carrier (), the module () has an integrated component () with at least two projecting connection contacts () and, for each connection contact (), a connecting part () which is electrically conductively connected thereto, the connecting parts () consisting of metal, being constructed so as to be plate-shaped, and including remnants () of raised portions which have been formed by mechanical deformation of the connecting parts ().

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Graz, Austria

Rainer Moll