Infineon Technologies Ag

Rainer Markus Schaller

Horst Theuss

Volker Strutz

Klaus Elian

Franz Jost

Jochen Dangelmaier

Matthias Eberl

Stefan Kolb

Simon Gassner

Thomas Mueller

Thorsten Meyer

Juergen Hoegerl

Martin Gruber

Markus Dinkel

Bernhard Rieder

Franz-Peter Kalz

Stefan Mieslinger

Liu Chen

Goran Keser

Toni Salminen

Jens Oetjen

Giuliano Angelo Babulano

Alfons Dehe

Gottfried Beer

Wolfgang Raberg

Guenther Ruhl

Christian Geissler

Maciej Wojnowski

Christoph Steiner

Cyrus Ghahremani

Matthias Rose

Hansjoerg Walter Kuemmel

Walter Hartner

Fabian Merbeler

Tuncay Erdoel

Sebastian Beer

Manuel Harrant

Ronak Kalhor-witzel

In some embodiments, a pressure sensor may comprise a housing, a flexible membrane which, together with the housing, forms a hermetically closed cavity, a sensor element arranged in the hermetically closed cavity, and a gaseous medium in the hermetically closed cavity. The sensor may detect a change in a physical property, of the flexible membrane, associated with an external pressure pressing inward into the flexible membrane of the hermetically closed cavity.

Media-resistant pressure sensor for large pressure ranges

A gas sensor comprises a sensor element for the detection of a gas, an encapsulation, which surrounds the sensor element and has an opening for a gas to be detected to pass through to the sensor element, and a flame arrester, which is arranged in the opening of the encapsulation.

Gas sensor with a sensor element and a flame arrester and use of the same for the detection of gases

A gas sensor comprises a substrate, a first semiconductor-based sensor element for determining the density and/or viscosity of a gas, which element is arranged above the substrate and which has a resonant element, and a cover arranged above the first sensor element, wherein the substrate and/or the cover has an opening to allow the passage of a gas to the first sensor element.

Gas sensor with a resonant element, method for producing the same and use of the same for detecting gases

In the following, a sensor assembly is described. According to an exemplary embodiment, the sensor assembly has a housing enclosing a pressure chamber filled with a medium, the housing having a first housing part and a second housing part, the first housing part being connected to the second housing part to seal the pressure chamber in a pressure-tight manner A sensor chip is arranged in the pressure chamber, substantially surrounded by the medium, and configured to measure a pressure of the medium. The sensor assembly also includes a plurality of connection pins which are fed through the first housing part (carrier) by pressure-tight bushings and which are electrically connected to the sensor chip. The sensor assembly also has stress relieving structures which are configured to mechanically decouple the first housing part and a pressure-sensitive element of the sensor chip.

Pressure sensor assembly

A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

Photoacoustic sensors and MEMS devices

A sensor device contains a busbar, a dielectric shell arranged over the busbar, a dielectric layer arranged over the busbar, and a sensor chip arranged within the dielectric shell, wherein the sensor chip is configured to detect a magnetic field induced by an electric current flowing through the busbar.

Sensor devices with busbar and sensor chip and dielectrics arranged therebetween

A current sensor includes a current rail and a magnetic field sensor. The magnetic field sensor is configured to measure a magnetic field induced by a current flowing through the current rail. A first insulation layer and a second insulation layer are arranged between the current rail and the magnetic field sensor. An interface between the first insulation layer and the second insulation layer is free of a contact with the current rail and/or is free of a contact with the magnetic field sensor. A portion of the current rail extends into the second insulation layer and the portion of the current rail is encapsulated by the second insulation layer.

Current sensor that includes a current rail and a magnetic field sensor with galvanic isolation

An ultrasonic transducer includes at least one ultrasonic transducer element, a semiconductor chip that includes the ultrasonic transducer element, and a housing. The semiconductor chip is arranged in the housing. The semiconductor chip is embedded in a dimensionally stable encapsulation, wherein a contact surface of the dimensionally stable encapsulation is configured for acoustically coupling the ultrasonic transducer to a casing. Additionally, an ultrasonic transducer system and a method for fitting the ultrasonic transducer or ultrasonic transducer system are provided.

Ultrasonic transducer

An ultrasonic touch sensor is proposed for attachment to a casing, having a semiconductor chip including a substrate side and a component side, the semiconductor chip including an ultrasonic transducer element and the ultrasonic transducer element being arranged on the component side, having an acoustic coupling medium covering the semiconductor chip at least in the region of the ultrasonic transducer element, having electrical contact elements for controlling the ultrasonic transducer element, and the electrical contact elements being arranged on the component side of the semiconductor chip.

Ultrasonic touch sensor

A gas sensor includes a hollow space, a gas permeation structure which is arranged between the hollow space and the exterior space and contains a selectively gas-permeable element, wherein the hollow space is hermetically sealed with the exception of the gas permeation structure, and one or more sensor elements which are configured for detecting the presence of one or more gases in the hollow space.

Gas sensor having a hollow space and a gas permeation structure having a selectively gas-permeable element

A sensor device contains a first magnetic field sensor chip having a first sensor element. The first magnetic field sensor chip is configured to detect a component of a magnetic field at the location of the first sensor element. The sensor device contains a second magnetic field sensor chip having a second sensor element. The second magnetic field sensor chip is configured to detect a component of a magnetic field at the location of the second sensor element. The sensor device contains a current conductor configured to carry a measurement current that induces a magnetic field at the locations of the sensor elements. The magnetic field sensor chips and the current conductor are arranged relative to one another in such a way that an influence of a homogeneous magnetic stray field on the first components is compensated for upon difference formation or summation applied to the first components.

Sensor devices, associated production methods and methods for determining a measurement current

A method for producing sensor devices includes generating a semiconductor wafer having a plurality of sensor chips, wherein each sensor chip comprises a micro-electromechanical systems (MEMS) structure arranged at a main surface of the semiconductor wafer; forming a plurality of gas-permeable covers over the main surface of the semiconductor wafer, wherein each gas-permeable cover covers a corresponding MEMS structure of the MEMS structures and forms a cavity above the corresponding MEMS structure; and singulating the semiconductor wafer into a plurality of sensor devices.

Sensor devices with gas-permeable cover and associated production methods

A photoacoustic detector unit comprises a housing having an opening, and also a photoacoustic transducer designed to convert optical radiation into at least one from a pressure signal or a heat signal. The photoacoustic transducer covers the opening of the housing, such that the photoacoustic transducer and the housing form an acoustically tight cavity. A pressure pick-up is arranged in the acoustically tight cavity.

Photoacoustic detector unit, photoacoustic sensor and associated production methods

A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide. The radio-frequency device furthermore comprises a gap arranged between a first side of the radio-frequency package and a second side of the waveguide component, and a shielding structure, which is configured: to permit a relative movement between the radio-frequency package and the waveguide component in a first direction perpendicular to the first side of the radio-frequency package, and to shield the transmission signals and/or the reception signals in such a way that a propagation of the signals via the gap is attenuated or prevented.

Radio-frequency devices and methods for producing radio-frequency devices

A sensor device includes a sensor which is configured to detect a physical quantity generated by an impact event and to generate first measurement data based on the impact event. The sensor device also includes a MEMS microphone configured to detect sound waves generated by the impact event and to generate second measurement data based on the impact event. The sensor device is configured to provide the first measurement data and the second measurement data to a logic unit. The logic unit is configured to detect the impact event based on a combination of the first measurement data and the second measurement data.

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Saal a.d. Donau, Germany

Rainer Markus Schaller