Infineon Technologies Ag

Siemens Aktiengesellschaft

Altis Semiconductor, Snc

Qimonda Ag

International Business Machines Corporation

Altis Semiconductor

Osram Opto Semiconductors Gmbh

Siemens Aktiengesell Schaft

Rainer Leuschner

Recai Sezi

Michael Sebald

Siegfried Birkle

Hellmut Ahne

Ulrich Karl Klostermann

Horst Theuss

Bernhard Goller

Gunther Mackh

Matthias Lipinski

Eva Rissel

Eberhard Kuehn

Egon Mergenthaler

Horst Borndoerfer

Bernhard Winkler

Albert Hammerschmidt

Uwe Seidel

Daniel Braun

Kerstin Kaemmer

Vijaye Rajaraman

Marten Oldsen

Kamil Karlovsky

Roland Meier

Karolina Zogal

Horst Borndorfer

Juergen Beck

Thorsten Meyer

Edward Fuergut

Klaus Elian

Gottfried Beer

Gerald Ofner

Michael Sorger

Magdalena Forster

Katharina Schmut

Erwin Schmidt

Karl Mayer

Reinhard Hess

Rafael Janski

Francisco Javier Santos Rodriguez

Lubomyr Taras Romankiw

John Kenneth DeBrosse

Richard Ferrant

Reinhold Bayerer

Michael C Gaidis

Günter Schmid

Wolfgang Raberg

Manfred Engelhardt

Hermann Wendt

Gerhard Mueller

Heinz Hoenigschmid

Ravi Keshav Joshi

Peter Beer

Wolfgang Rogler

Xian Jay Ning

Alexander Breymesser

Georg Wittmann

Michael Roesner

Dominic Maier

Dietmar Gogl

Gudrun Stranzl

John Casimir Slonczewski

Arvid Hunze

Thomas Christian Neidhart

Judith Marie Rubino

Eberhard Kuhn

Stephen L Brown

Gill Yong Lee

Martin Zgaga

Michael Stoisiek

Bernhard Knott

Johann Kammermaier

Hans-Dieter Feucht

Tobias Noll

Manfred Waidhas

Waltraud Herbst

Gertrud Falk

Peter Zorn

Ulrich Gebhardt

Stefan Ottow

George Stojakovic

Bernhard Lippmann

Stefan Wallstab

Guy LeFranc

Frank Findeis

Jochen Fricke

J&uuml;rgen Simmerer

Hans Jurgen Bestmann

Ann Dumoulin

Raino Petricevic

Guy Lefranc

Monika Cornelia Voerckel

Ewald G&uuml;nther

Bernhard Boche

Eva-Maria Rissel

Rolf-W Schulte

Michael Vieth

Sivanandha K Kanakasabapathy

Kim Woosik

Bernd Noehammer

Ewald Guenther

A sensor device includes a sensor unit sensitive for a property of a gaseous medium. The sensor unit is formed on a first surface of a sensor substrate. A frame structure on the first surface includes a first loop portion laterally surrounding a first area that includes the sensor unit. A communicating channel accesses the first area through at least one of a lateral port in the first loop portion and a base port in the sensor substrate. A lid structure completely covers the frame structure and the first area.

Sensor device including sensor unit for a gaseous medium

Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port.

MEMS sensor package systems and methods

Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.

Methods for processing a semiconductor workpiece

A method for manufacturing an inductor core is developed, wherein the method comprises the following: Forming a first electrical conductor on a first surface of a plate-shaped magnetic core; forming a second electrical conductor on a second surface of the plate-shaped magnetic core, which is opposite the first surface; and forming the inductor core by dicing the plate-shaped magnetic core transverse to the first electrical conductor and second electrical conductor.

Method of manufacturing an inductor core for a chip assembly and chip assembly

A method of manufacturing a lithium ion battery includes: attaching a lid to a first main surface of a first substrate, the lid including a conductive coves element; forming a cavity between the lid and the first substrate; forming an anode comprising a component made of a semiconductor material at the first substrate; forming a cathode at the lid; and filling an electrolyte into the cavity.

Method of manufacturing a lithium ion battery

A lithium ion battery includes a first substrate having a first main surface, and a lid including an insulating material. The lid is attached to the first main surface of the first substrate, and a cavity is defined between the first substrate and the lid. The lithium ion battery further includes an electrical interconnection element in the lid, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the lid. The lithium ion battery further includes an electrolyte in the cavity, an anode at the first substrate, the anode including a component made of a semiconductor material, and a cathode at the lid.

Lithium ion battery, integrated circuit and method of manufacturing a lithium ion battery

A lithium ion battery includes a first substrate having a first main surface, and a lid including a conductive cover element, the lid being attached to the first main surface. A cavity is formed between the first substrate and the lid. The battery further includes an electrolyte disposed in the cavity. An anode of the battery includes a component made of a semiconductor material and is formed at the first substrate, and a cathode of the battery is formed at the lid.

A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.

Apparatus comprising and a method for manufacturing an embedded MEMS device

Through substrate features in semiconductor substrates are described. In one embodiment, the semiconductor device includes a through substrate via disposed in a first region of a semiconductor substrate. A through substrate conductor coil is disposed in a second region of the semiconductor substrate.

Through substrate features in semiconductor substrates

One or more embodiments relate to a method for making a semiconductor structure, comprising: providing a substrate; forming a dielectric layer over the substrate; forming a first opening and a second opening at least partially simultaneously through the dielectric layer over the substrate; and forming a third opening through the bottom surface of the first opening and into at least a portion of the substrate.

Semiconductor structure and method for making same

The capacitance or inductance of electrical circuits is adjusted by measuring inductance or capacitance values of passive components fabricated on a first substrate, storing individual associations between the passive components and the respective measured values of the passive components, and determining electrical connections for the passive components based on the stored individual associations between the passive components and the respective measured values of the passive components. A corresponding system includes a tester operable to measure inductance or capacitance values of the passive components fabricated on the first substrate, a storage system operable to store the individual associations between the passive components and the respective measured values of the passive components, and a processing circuit operable to determine the electrical connections for the passive components based on the stored individual associations between the passive components and the respective measured values of the passive components.

Electrical measurement based circuit wiring layout modification method and system

Growing community of inventors

Wuppertal, Germany

Rainer Leuschner