Osram Opto Semiconductors Gmbh

Osram Ag

Osram Gesellschaft MIT Beschrankter Haftung

Rainer Huber

Markus Hofmann

Stefan Grötsch

Moritz Engl

Peter Brick

Joachim Reill

Sebastian Wittmann

Michael Brandl

Ludwig Hofbauer

Thomas Schwarz

Markus Heinrich Klein

Stefan Groetsch

Andreas Dobner

Mario Wanninger

Uli Hiller

Michael Wittmann

Matthias Goldbach

Michael Sailer

Ulrich Frei

Andreas Waldschik

Matthias Bruckschloegl

Peter Helbig

Gerhard Behr

Thomas Reiners

Ralf Vollmer

Alois Biebl

Günther Hirschmann

Heinz Haas

Stefan Hackenbuchner

Kurt-Jürgen Lang

Herbert Brunner

Ulrich Streppel

Alexander Wilm

Harald Stoyan

Steffen Köhler

Norbert Häfner

Steffen Block

Monika Rose

Kurt Jürgen Lang

Stefan GRÖTSCH

An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.

Optoelectronic device

Optoelectronic arrangement is proposed for use in a transparent glazing element of a vehicle, for example. The arrangement comprises at least one substantially transparent carrier layer, at least one conductor layer comprising conductor paths provided on at least one side of said carrier layer, at least one light emitting element arranged on the carrier layer and electrically coupled to conductor paths on said conductor layer and at least one proximity and/or touch sensor arranged on at least one of said carrier layers, the arrangement further being couplable to a control module for controlling the operation of said at least one light emitting element in response to information from said at least one proximity and/or touch sensor.

Optoelectronic arrangement

An optoelectronic device, in particular an at least semi-transparent pane for example for a vehicle, comprises: a cover layer, a carrier layer, an intermediate layer between the cover layer and the carrier layer, wherein at least one and preferably a plurality of optoelectronic light sources, in particular μLEDS, is arranged on at least one surface of the intermediate layer and/or is at least partially embedded in the intermediate layer, wherein the intermediate layer is adapted such that light emitted by the optoelectronic light sources at least partially spreads in and along the intermediate layer and exits the intermediate layer within and/or at a pre-set distance to the respective optoelectronic light source in a direction through the cover layer and/or through the carrier layer.

An optoelectronic device comprises a plurality of optoelectronic light sources being arranged on a first layer, in particular an intermediate layer being arranged between a cover layer and a carrier layer. The first layer comprises or consists of an at least partially transparent material and each optoelectronic light source of the plurality of optoelectronic light sources comprises an individual light converter for converting light emitted by the associated light source into converted light. The light converter of each optoelectronic light source is arranged on the first layer and/or the associated optoelectronic light source.

An optoelectronic module () is defined, comprising at least one semiconductor chip () provided for emitting electromagnetic radiation and at least one holding device () which is adapted to fix in place a device () for encoding at least one optical or electronic parameter of the optoelectronic module (). Furthermore, a process for the production of the optoelectronic module () is defined.

Optoelectronic module and a process for the production of an optoelectronic module

A method is set up to operate an arrangement that has N radiation-emitting semiconductor chips arranged in an electric series circuit. The arrangement includes multiple switching elements, wherein to each of the semiconductor chips one of the switching elements is connected electrically in parallel. The arrangement includes a controller for the mutually independent activation of the switching elements. The arrangement includes a constant current circuit for energizing the series circuit. When switching off, the respective semiconductor chip associated with a switching element is bridged electrically by the switching element. A protective module of the arrangement is set up to reduce or to prevent current peaks when one or more of the semiconductor chips is/are switched off.

Arrangement and method for operating an arrangement

A luminous module comprising a plurality of radiation-emitting semiconductor components (), a connection carrier (), on which the radiation-emitting semiconductor components () are arranged, and a cooling body (), which, on its front-side surface, is connected to the connection carrier () and has a basic body () and also a means (), which is designed to locally alter the thermal resistance of the cooling body (), wherein the average thermal resistance of the cooling body () decreases along a main extension direction of the luminous module ().

Lighting module

A motor vehicle headlight element is specified which has at least one light-emitting diode and at least one control apparatus. The control apparatus is suitable for processing a signal which is dependent on a measurement variable and for applying a current, corresponding to the signal, to the light-emitting diode. The control apparatus and the light-emitting diode are arranged on a common mount.

Motor vehicle headlight element

An LED housing having a housing cavity, a carrier element, LED chips, the LED housing being formed in such a way that it may connect a plurality of LED housings of identical construction and, by its shaping, is additionally mountable in various ways.

LED housing system

Disclosed is a lighting device comprising at least one LED and at least one optical element, wherein the LED and the optical element are aligned with each other by means of at least one dowel pin. A method of making such a lighting device is also specified. The described lighting device is particularly well suited for use in a vehicle headlight.

Lighting device, automotive headlights and method for producing a lighting device

A lamp with a base () and at least one light emitting semiconductor component () is disclosed. The base has at least two external electrical connections () and at least two electrical connection parts (). The electrical connection parts are provided for electrically connecting the light emitting semiconductor component and are respectively connected to one of the external electrical connections in an electrically conducting manner. The light emitting semiconductor component is mounted on a carrier () and is electrically connected to at least two electrical contacting elements (), which are arranged and/or fixed on the carrier. Each of the electrical contacting elements is directly adjacent to one of the electrical connection parts and connected to it in an electrically conducting manner.

Lamp comprising a base and at least one light-emitting semiconductor component

A motor vehicle headlight element is specified which has at least one light-emitting diode and at least one control apparatus. The control apparatus is suitable for processing a signal which is dependent on a measurement variable and for applying a current corresponding to the signal, to the light-emitting diode. The control apparatus and the light-emitting diode are arranged on a common mount.

A motor-vehicle headlight is specified, having at least one light-emitting diode, and an apparatus for controllable manipulation of the beam path of the electromagnetic radiation emitted from the light-emitting diode. The described motor-vehicle headlight is distinguished inter alia by a particularly variable emission characteristic.

Motor-vehicle headlight

An illumination device comprising a connection carrier (), at least one light-emitting diode (), an electrically insulating layer () and a fixing device () is specified. The connection carrier () has a first main area () and a second main area () remote from the first main area. The light-emitting diode () is fixed on the first main area () of the connection carrier (). The electrically insulating layer () is fitted to the second main area () of the connection carrier () and projects laterally beyond the second main area () of the connection carrier (). The fixing device () is suitable for fixing the illumination device to a mounting area () of a carrier (), wherein the electrically insulating layer () is arranged between the second main area () of the connection carrier () and the mounting area () of the carrier (). Furthermore, the fixing device () presses the connection carrier () against the mounting area (). The pressure exerted in this way is used to effect a fixing of the insulating layer () between the second main area () of the connection carrier () and the mounting area (). The fixing device () is connected to an optical element (), which optically influences the light generated by the light-emitting diode () during operation.

Illuminating device

A light-emitting diode arrangement having at least one light-emitting diode chip (), each light-emitting diode chip () being assigned at least one optical element (). In addition, the light-emitting diode arrangement has at least one heat-conducting element () which is suitable to carry away the heat generated by the light-emitting diode chip, and at least one cooling apparatus which is suitable to carry heat away from the heat-conducting element. The light-emitting diode arrangement is particularly well suited, for example, to use in motor vehicle headlamps.

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Pentling, Germany

Rainer Huber