Infineon Technologies Ag

Rainer Holmer

Stephan Bradl

Georg Seidemann

Gunther Mackh

Berthold Schuderer

Dieter Kohlert

Sabine Penka

Grit Schwalbe-Dietrich

Bernhard Duschinger

Josef Hermann

Erhard Sixt

A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a multiplicity of information regarding the monocrystalline and surface and also rear side constitution. A multiplicity of semiconductor device positions arranged in rows and columns are provided on the top side of the semiconductor wafer, an information chip being arranged at an exposed semiconductor device position, the information chip having at least the information of the rear side identification.

Method for producing a semiconductor wafer with rear side identification

Semiconductor wafer with rear side identification and method

An embodiment of an integrated circuit comprises a plurality of cells. Each cell comprises a first supply node, a second supply node, a series connection with a first transistor, a second transistor and an electrical element. The series connection is coupled between the first and the second supply node. The electrical element includes a first and a second node. A third transistor is coupled between the first node of the electrical element and a first output node of the cell and a fourth transistor is coupled between the second node of the electrical element and the second output node of the cell. A control terminal of the first, the third and the fourth transistor is coupled to a first control node of the cell and a control terminal of the second transistor is coupled to a second control node of the cell.

Integrated circuit, method for acquiring data and measurement system

Growing community of inventors

Steinach, Germany

Rainer Holmer