Intel Corporation

Rainer E Thomas

Damion T Searls

James Daniel Jackson

Charles A Gealer

Weston C Roth

Margaret D Ramirez

Christina K Williams

Disclosed are embodiments of a system-level assembly including an integrated circuit (IC) die directly attached to a mainboard. An IC die directly attached to a mainboard or other circuit board may be referred to as a direct-chip attach (DCA) die. A package is disposed over at least a portion of the DCA die and coupled with the mainboard. The package includes one or more other IC die disposed on a substrate. Other embodiments are described and claimed.

Mainboard assembly including a package overlying a die directly attached to the mainboard

An apparatus, method, and system for electronic device packaging having stacked dice are disclosed herein. A first die has a through silicon via formed therethrough. A second die is landed on the through silicon via of the first die. A mount having a lead is coupled to the through silicon via of the first die.

Electronic packaging including die with through silicon via

Growing community of inventors

Beaverton, OR, United States of America

Rainer E Thomas