Koninklijke Philips Corporation N.v.

Philips Lighting Holding B.v.

Signify Holding B.v.

Philips Gmbh

Raimond Louis Dumoulin

Ralph Kurt

Armand Pruijmboom

Michael Miller

Martinus Petrus Joseph Peeters

Stephan Gronenborn

Lucas Josef Maria Schlangen

René Theodorus Wegh

Stefan Marcus Verbrugh

Wouter Oepts

Marcellus Jacobus Johannes Van Der Lubbe

Wiebe Wagemans

The invention provides a lighting device () comprising a first set of light emitting diodes () arranged to emit light () in a first wavelength range of 300 nm-490 nm, a second set of light emitting diodes () arranged to emit light () in a second wavelength range of 300 nm-490 nm, a first luminescent element () radiationally coupled to the first and second set of light emitting diodes and arranged to convert at least a part of the light of the first wavelength range and at least a part of the light of the second wavelength range into first luminescent element light, a second luminescent element () radiationally coupled to at least a subset of the second set of light emitting diodes and arranged to convert at least a part of the light () of the second wavelength range into second luminescent element light, wherein, during operation, the brightness level of the light () emitted by the first set of light emitting diodes () and the brightness level of the light () emitted by the second set of light emitting diodes (), respectively, is controllable independently of each other and wherein the lighting device is arranged to generate white lighting device light ().

Lighting device comprising at least two sets of LEDs

A light emitting arrangement is adapted to produce white output light of a total luminous intensity Itot and having an emission peak in the wavelength range of from 400 to 440 nm, comprising: a first light emitting element adapted to emit light of a first luminous intensity Iand having an emission peak in a first wavelength range of from 440 to 460 nm; and a second light emitting element adapted to emit light of a second luminous intensity Iand having an emission peak in a second wavelength range of from 380 to 440 nm, wherein the first light emitting element and the second light emitting element are independently controllable such that Ican be adjusted independently of I. The possibility of controlling the contribution of deep blue light allows a natural appearance of a crisp white light source at all emission intensities, and may also be used to enhance perception of contrast.

Light emitting arrangement with adjustable emission spectrum

The invention describes a method of manufacturing a VCSEL module () comprising at least one VCSEL chip () with an upper side (U) and a lower side (L) and with a plurality of VCSEL units () on a common carrier structure (), the VCSEL units () comprising a first doped layer () of a first type facing towards the lower side (L) and a second doped layer () of a second type facing towards the upper side (U). The method comprises the steps of dividing the VCSEL chip () into a plurality of subarrays () with at least one VCSEL unit () each, electrically connecting at least some of the subarrays () in series. The invention also describes a VCSEL module () manufactured in such process.

VCSEL module and manufacture thereof

The present invention relates to a method of assembling VCSEL chips () on a sub-mount (). A de-wetting layer () is deposited on a connecting side of the VCSEL chips () which is to be connected to the sub-mount (). A further de-wetting layer () is deposited on a connecting side of the sub-mount () which is to be connected to the VCSEL chips (). The de-wetting layers () are deposited with a patterned design or are patterned after depositing to define connecting areas () on the sub-mount () and the VCSEL chips (). A solder () is applied to the connecting areas () of at least one of the two connecting sides. The VCSEL chips () are placed on the sub-mount () and soldered to the sub-mount () to electrically and mechanically connect the VCSEL chips () and the sub-mount (). With the proposed method a high alignment accuracy of the VCSEL chips () on the sub-mount () is achieved without time consuming measures.

Method of assembling VCSEL chips on a sub-mount

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Maarheeze, Netherlands

Raimond Louis Dumoulin