Astec International Limited

Astee International Limited

Rahul Vinaykumar Davare

Robert Henry Kippley

Todd Martin Schaible

Kwong Kei Chin

An AC/DC power converter includes input terminals, output terminals, a power factor correction circuit coupled between the input and output terminals and including at least one power switch defining a switched current path, and a current transformer including a primary winding and a secondary winding. The primary winding is coupled in series with the switched current path. The power converter also includes a first sense switch coupled with a first end of the secondary winding, a second sense switch coupled with a second end of the secondary winding, and a control circuit. The control circuit is configured to turn on the first sense switch and turn off the second sense switch during a positive polarity of the AC voltage input, and to turn off the first sense switch and turn on the second sense switch during a negative polarity of the AC voltage input.

AC/DC power converters including current transformers for bidirectional current sensing

A rectifier circuit for a power supply includes a diode bridge, a first metal-oxide-semiconductor field-effect transistor (MOSFET) and a second MOSFET each coupled in parallel with corresponding diodes of the diode bridge to reduce losses associated with bridge diode voltage drops and increase conversion efficiency. A self-driven driver circuit is coupled for controlling switching operation of the first MOSFET and the second MOSFET to operate the first MOSFET and the second MOSFET as high-side floating synchronous rectifiers. Methods of supplying power via a rectifier circuit of a power supply are also described.

Rectifier circuits for electrical power supplies

According to some aspects of the present disclosure, heat sink assemblies are disclosed. Example heat sink assemblies include a printed circuit board having a first side and a second side. The printed circuit board defines an opening extending from the first side to the second side. The heat sink assembly also includes a heat sink coupled to the first side of the printed circuit board. The heat sink includes a protrusion extending through the through opening of the printed circuit board. The heat sink assembly further includes a surface mounted device coupled to the second side of the printed circuit board. The surface mounted device is in thermal contact with the protrusion of the heat sink to transfer heat from the surface mounted device to the heat sink. Example methods of manufacturing heat sink assemblies are also disclosed.

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Eden Prairie, MN, United States of America

Rahul Vinaykumar Davare