Alpha Assembly Solutions Inc.

Other

Macdermid Autotype Limited

Rahul Raut

Bawa Singh

Siuli Sarkar

Ranjit Pandher

Sutapa Mukherjee

Anna Lifton

Nirmalya Kumar Chaki

Morgana De Avila Ribas

Barun Das

Oscar Khaselev

Sathish Kumar

Sanyogita Arora

Remya Chandran

Pavan Vishwanath

Shamik Ghosal

Chetan Pravinchandra Shah

Supriya Devarajan

Ashok Pachamuthu

Nitin Vithalbhai Desai

Monnir Boureghda

Anubhav Rustogi

Ravi Bhatkal

Narahari Pujari

Keith Paul Parsons

Anna Jane Harris

Ramakrishna Hosur Venkatagiriyappa

Harish Hanchina Siddappa

Jeffrey William Braham

Ravindra Mohan Bhatkal

Bin Mo

Venodh Manoharan

Nitin Desai

Morgana Ribas

Shu Tai Yong

Ramakrishna Hosur Katagiriyappa

Nirmalyakumar Chaki

Traian Cornel Cucu

Arora Sanyogita

Proloy Nandi

Kamanio Chattopadhyay

Dominic Lodge

A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

Sintering powder

This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.

Graphene enhanced and engineered materials for membrane touch switch and other flexible electronic structures

A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 w. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.

Low temperature soldering solutions for polymer substrates, printed circuit boards and other joining applications

Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.

Applications of engineered graphene

A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

Nano copper paste and film for sintered die attach and similar applications

Sintering paste

A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein:

Engineered polymer-based electronic materials

A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

Joining to aluminum

Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

Rosin-free thermosetting flux formulations

Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.

Dual-side reinforcement flux for encapsulation

Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

Flux formulations

Growing community of inventors

Edison, NJ, United States of America

Rahul Raut