Washington State University

Rahul Panat

Deuk Hyoun Heo

Indranath Dutta

Lei Li

Novel methods for micro-additive manufacturing three dimensional sub-millimeter components are disclosed herein. The methods can include dispensing a dielectric at positions on a substrate so as to provide dielectric structures having an aspect ratio of up to 1:20. The methods can also include in-situ curing of the dielectric structure upon dispensing of the dielectric wherein the dispensing and curing steps provide for three dimensional configurations. Direct printing a metal nanoparticle solution on the dielectric to create conductive traces and thereafter sintering the printed nanoparticle solution so as to cure the conductive traces enables three dimensional conductive (antenna) elements having a length and width scale of down to 1 &#x3bc;m.

Three dimensional sub-mm wavelength sub-THz frequency antennas on flexible and UV-curable dielectric using printed electronic metal traces

Three-dimensional inductors may comprise a passivation layer disposed on a substrate, a three-dimensional pillar comprising a ferromagnetic material disposed on the substrate or the passivation layer, and a conductive trace wound at least partially around the pillar. Three-dimensional capacitors may comprise a passivation layer disposed on a substrate, at least two support pillars comprising a polymeric material disposed on the passivation layer or the substrate, at least two electrodes disposed between the support pillars, a dielectric disposed between the electrodes, and a metal trace. Methods of manufacturing the three-dimensional passives, such as inductors and capacitors, may comprise direct writing the components and curing them for on-chip applications.

Three-dimensional passive components

A fiber grating device of low cost and arbitrary length is formed on a portion of a portion or the entirety of a highly elastic fiber optic core having a low Young's modulus of elasticity by causing elongation of the fiber optic core and forming or depositing a hard skin or cladding on the elongated fiber optic core. When the stress is then released, the hard skin or cladding buckles (including elastic or plastic deformation or both) to form wrinkles at the interface of the fiber optic core and the hard skin or cladding which are oriented circumferentially and highly uniform in height and spacing which can be varied at will by choice of materials, stretching, and thickness and composition of the cladding. Since the elastic elongation of the fiber optic core portion may be 200% or greater, an unprecedented measurement range is provided.

Low-cost fiber optic sensor for large strains

Techniques for forming highly stretchable electronic interconnect devices are disclosed herein. In one embodiment, a method of fabricating an electronic interconnect device includes forming a layer of an adhesion material onto a surface of a substrate material capable of elastic and/or plastic deformation. The formed layer of the adhesion material has a plurality of adhesion material portions separated from one another on the surface of the substrate material. The method also includes depositing a layer of an interconnect material onto the formed layer of the adhesion material. The deposited interconnect material has regions that are not bonded or loosely bonded to corresponding regions of the substrate material, such that the interconnect material may be deformed more than the adhesion material attached to the substrate material. In certain embodiments, the interconnect material can also include a plurality of wrinkles on a surface facing away from the substrate material.

Growing community of inventors

Pullman, WA, United States of America

Rahul Panat