Allegro Microsystems, LLC

Raguvir Kanda

Paul A David

Shaun D Milano

Shixi Louis Liu

Harianto Wong

John B Sauber

Bruce Hemenway

In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.

Packaging for an electronic device

Housing for an electronic device

Growing community of inventors

North Attleboro, MA, United States of America

Raguvir Kanda