Intel Corporation

Raghavendra Doddi

Prakash Kurma Raju

Prasanna Pichumani

Bijendra Singh

Gopinath Kandasamy

David Pidwerbecki

Harish Jagadish

Babu Triplicane Gopikrishnan

Aleksander Magi

Arvind Sundaram

Soethiha Soe

Samarth Alva

Ayeshwarya B Mahajan

Marko Bartscherer

Gokul V Subramaniam

Kathiravan D

Sachin Bedare

Ritu Bawa

Triplicane Gopikrishnan Babu

Akarsha Rajeshwar Kadadevaramath

Sudheera Sudhakar

Bhavaneeswaran Anbalagan

Ravishankar Srikanth

Techniques for video conferencing are disclosed. In one embodiment, a mirror assembly can be used to position a mirror in front of a camera, reflecting a view of the camera downward towards a whiteboard or other drawing surface, allowing a user to show a drawing during a video conference. In another embodiment, video data and audio data of a user in a video conference can be analyzed to determine what portions of the video data and audio data should be transmitted to a remote participant in the video conference. Unintentional input supplied by the user in the video data and audio data may be used to determine which portions of the video data and audio data to transmit.

Technologies for video conferencing

An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.

Hinge assembly and guide assembly for electronic devices using a heat carrying member

There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

Thermal dissipation in dual-chassis devices

Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.

Keyboard that includes shape memory material

Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.

Flexible hinge to accommodate a flexible heat spreader

Growing community of inventors

Bengaluru, India

Raghavendra Doddi