Delphi Technologies, Inc.

King Fahd University of Petroleum and Minerals

Rafil A Basheer

Derek B Workman

Mohamed Bouguettaya

Richard M Laine

Ismat Ali Abu-Isa

Donald T Morelli

Arun K Chaudhuri

Ramil-Marcelo L Mercado

Santy Sulaiman

Chad M Brick

Christopher M Desana

The high impact strength conductive adhesive is a mixture formed from a bisphenol A-based epoxy resin, a curing agent, and silver flakes. In one embodiment, the bisphenol A-based epoxy resin forms about 10.5 wt % of the mixture and the curing agent forms about 14.5 wt % of the mixture, the balance being silver flakes. In this embodiment, the curing agent is preferably an oligomeric polyamine curing agent, such as amidoamine-polyoxypropylenediamine t-butyl phenol. Each silver flake preferably has a tap density of between about 4.0 g/cmand about 5.8 g/cm, and a surface area of between about 0.8 m/g and about 0.3 m/g. In an alternative embodiment, the bisphenol A-based epoxy resin forms about 11.7 wt % of the mixture and the curing agent forms about 16.3 wt % of the mixture, the balance being silver flakes.

High impact strength conductive adhesives

The thermosetable composition incorporating organo-iodine compounds that provide improved x-ray contrast are prepared by reacting an epoxy resin with crosslinking agents, wherein the crosslinking agents include compounds having iodo-phenyl functionalities, and wherein the iodine atoms include iodine-127 isotope. The resulting thermoset material includes sufficient iodine-127 isotope covalently bound to the polymer matrix to impart excellent x-ray contrast. The cured polymer materials of this invention may be utilized as underfill material for electrical components, thereby facilitating use of x-ray analysis to detect problematic voids in the underfill.

Radiopaque polymers for circuit board assembly

The present invention relates to rigid and clear thermosetting compositions formed from dendritic or hyperbranched polymers and cylcoaliphatic epoxy resins. The compositions may be used for coatings such as electronic device packaging, adhesives, wire coatings, and finishes.

Dendritic polyol, cycloaliphatic epoxy resin and cationic initiator

Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure:X&#x2014;((CH)&#x2014;(N)&#x2014;((CH)-(Z)))wherein X is an aromatic ring or a six membered cycloaliphatic ring, m is from about 0 to about 2, n is from about 1 to about 3, Z is an epoxy group of empirical formula: CHO, p is a number from about 2 to about 3, and (ii) a cross-linking agent comprising at least one polyamine. This curable composition is characterized by a CTE of no more than 60 ppm/&#xb0; C. when cured for a time of from about 20 to about 60 minutes at temperature of from about 100 to 240&#xb0; C. Also disclosed are methods of making integrated circuits and integrated circuits made there from, especially flip chips.

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

A themosettable material having excellent processability, and which cures to form a thermoset composition having a low coefficient of thermal expansion and a high glass transition temperature includes functionalized nanoscopic silica particles dispersed in a curable resin comprising a polyepoxide having at least three epoxide groups per molecule. The composition is useful as an underfill for flip-chip circuit assemblies.

Silica nanoparticles thermoset resin compositions

A system for underfilling in a chip package includes an underfill mixture that ameliorates the CTE mismatch that typically exists between a packaged die and a resin-impregnated fiberglass mounting substrate. In one embodiment, the system includes an underfill mixture that comprises a principal underfill composition of a rigid octaaminophenyl silsesquioxane (OAPS) that is used as a curing agent for a tetrafunctional, low viscosity, and relatively rigid TGMX epoxy resin. An embodiment is also directed to the assembly of a flip chip package that uses the underfill mixture.

Flip chip system with organic/inorganic hybrid underfill composition

An arc quenching electrical connector has a male pin terminal which inserts longitudinally into a receptacle or terminal having a gassing wall engaged concentrically about the receptacle. During 'hot unplugging' of the electrical connector, an arc is carried between a tip of the male pin and a contact surface of a leading end of the receptacle. The gassing wall extends over and is directly engaged to a portion of the contact surface. Because the gassing wall is also preferably an electrical insulator, the arc communicates electrically with the exposed contact surface and is biased directly against the gassing wall. The gassing wall, when heated by the adjacent arc, quenches or reduces the energy of the arc by releasing gas which eliminates arc erosion of the terminals.

Electrical connector

This disclosure relates to transducers, methods of making transducers and methods of converting between electrical energy and mechanical energy. The transducers comprise an elastomeric film disposed between two electrodes wherein at least one electrode can be a compliant electrode. The elastomeric film comprises a polyphosphazene.

Elastomeric polyphosphazene transducers, methods of making, and methods of use thereof

A magnetostrictive composite having large magnetostriction by virtue of 2-50 vol. % magnetostrictive particles dispersed throughout a resin matrix formed from a thermosetting resin, an amine curing agent, fumed silica and a flexibilizing agent, wherein the magnetostrictive particles are aligned in the direction of their magnetic easy axes by the presence of a magnetic field prior to or during curing of the resin matrix. In an exemplary embodiment, an epoxy-Terfenol composite is formed by mixing an epoxy resin, fumed silica, a cycloaliphatic amine curing agent, and a flexibilizing agent that is a flexible diepoxide of EEW 390-470 or a mixture of a high molecular weight polyamine of MW 2000-5000 and a low molecular weight polyamine of MW 230-450 with Terfenol particles and curing the mixture in the presence of a magnetic field.

Growing community of inventors

Rochester Hills, MI, United States of America

Rafil A Basheer