Agere Systems Inc.

Rafe Carl Mengel

Sailesh Mansinh Merchant

Taeho Kook

Daniel Patrick Chesire

Philip William Seitzer

Joze E Antol

Vance Dolvan Archer

Thomas B Gans

Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe regionfrom the wire bond regionand forming the bond padover active circuitry has several advantages. By separating the probe regionfrom the wire bond region, the wire bond regionis not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond padover active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.

Reinforced bond pad for a semiconductor device

Growing community of inventors

Hamburg, PA, United States of America

Rafe Carl Mengel