Koninklijke Philips Corporation N.V.

Rafael Goshen

Simha Levene

Nicolaas Johannes Anthonius Van Veen

Amiaz Altman

Cornelis Reinder Ronda

Naor Wainer

Amir Livne

David Yogev

Antonius Wilhelmus Maria De Laat

Gerardus Franciscus Cornelius Maria Lijten

Igor Uman

Lev Gregorian

The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

Radiation detector element

A scintillator pack () and a CT X-ray detector array () comprising such scintillator pack () are proposed. The scintillator pack () comprises an array of scintillator pixels (). At a bottom surface () of each scintillator pixel (), an X-ray absorbing encapsulation () is provided. This encapsulation () comprises an electrically insulating highly X-ray absorbing material having an atomic number greater than 60 such as, for example, Bismuth oxide (BiO). The X-ray absorbing encapsulation () is interposed between the scintillator pixels () and an electronic circuit (). The electronic circuit () may be provided as an ASIC in CMOS technology and may therefore be sensitive to X-ray induced damage. The encapsulation () provides for good X-ray protection of such electronic circuit ().

Scintillator pack comprising an X-ray absorbing encapsulation and X-ray detector array comprising such scintillator pack

An imaging system () includes a radiation sensitive detector array (). The detector array includes at least two scintillator array layers (). The detector array further includes at least two corresponding photosensor array layers (). At least one of the at least two photosensor array layers is located between the at least two scintillator array layers in a direction of incoming radiation. The at least one of the at least two photosensor array layers has a thickness that is less than thirty microns.

Multi-layer horizontal computed tomography (CT) detector array with at least one thin photosensor array layer disposed between at least two scintillator array layers

A scintillator element () comprising uncured scintillator material () is formed and optically cured to generate a cured scintillator element (). The uncured scintillator material suitably combines at least a scintillator material powder and an uncured polymeric host. In a reel to reel process, a flexible array of optical detectors is transferred from a source reel () to a take-up reel () and the uncured scintillator material () is disposed on the flexible array and optically cured during said transfer. Such detector layers () are stackable to define a multi-layer computed tomography (CT) detector array (). Detector element channels () include a preamplifier () and switching circuitry () having a first mode connecting the preamplifier with at least first detector array layers () and a second mode connecting the preamplifier with at least second detector array layers ().

CT detector including multi-layer fluorescent tape scintillator with switchable spectral sensitivity

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Haifa, Israel

Rafael Goshen